Jane-Bai Lai

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Optical detecting device and optical package structure
- Patent number 10,439,076
- Issue date Oct 8, 2019
- Anpec Electronics Corporation
- Chih-Cheng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment method for electromigration reduction
- Patent number 7,208,415
- Issue date Apr 24, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jane-Bai Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wet etching low dielectric constant materials
- Patent number 6,780,783
- Issue date Aug 24, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jane-Bai Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving the bondability between Au wires and Cu bonding...
- Patent number 6,753,259
- Issue date Jun 22, 2004
- Syun-Ming Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and solution for preparing SEM samples for low-K materials
- Patent number 6,660,655
- Issue date Dec 9, 2003
- Taiwan Semiconductor Manufacturing Company
- Jane-Bai Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving the bondability between Au wires and Cu bonding...
- Patent number 6,423,625
- Issue date Jul 23, 2002
- Taiwan Semiconductor Manufacturing Company Ltd.
- Syun-Ming Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing phase transition temperature by using silicon-ge...
- Patent number 6,399,487
- Issue date Jun 4, 2002
- Taiwan Semiconductor Manufacturing Company
- Jane-Bai Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to improve copper-fluorinated silica glass interconnects
- Patent number 6,136,680
- Issue date Oct 24, 2000
- Taiwan Semiconductor Manufacturing Company
- Jane-Bai Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion prom...
- Patent number 6,083,829
- Issue date Jul 4, 2000
- Taiwan Semiconductor Manufacturing Company
- Jane-Bai Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to improve adhesion between copper and titanium nitride, for...
- Patent number 6,015,749
- Issue date Jan 18, 2000
- Taiwan Semiconductor Manufacturing Company
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DETECTING DEVICE AND OPTICAL PACKAGE STRUCTURE
- Publication number 20190259882
- Publication date Aug 22, 2019
- ANPEC ELECTRONICS CORPORATION
- CHIH-CHENG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment method for electromigration reduction
- Publication number 20060003486
- Publication date Jan 5, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jane-Bai Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and solution for preparing SEM samples for low-K materials
- Publication number 20030157802
- Publication date Aug 21, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Jane-Bai Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of wet etching low dielectric constant materials
- Publication number 20030049938
- Publication date Mar 13, 2003
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Jane-Bai Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving the bondability between Au wires and Cu bonding...
- Publication number 20020086533
- Publication date Jul 4, 2002
- Syun-Ming Jang
- H01 - BASIC ELECTRIC ELEMENTS

Jane-Bai Lai

Person

Patents Grantslast 30 patents

Optical detecting device and optical package structure

Plasma treatment method for electromigration reduction

Method of wet etching low dielectric constant materials

Method of improving the bondability between Au wires and Cu bonding...

Method and solution for preparing SEM samples for low-K materials

Method of improving the bondability between Au wires and Cu bonding...

Method of reducing phase transition temperature by using silicon-ge...

Methods to improve copper-fluorinated silica glass interconnects

Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion prom...

Method to improve adhesion between copper and titanium nitride, for...

Patents Applicationslast 30 patents

OPTICAL DETECTING DEVICE AND OPTICAL PACKAGE STRUCTURE

Plasma treatment method for electromigration reduction

Method and solution for preparing SEM samples for low-K materials

Method of wet etching low dielectric constant materials

Method of improving the bondability between Au wires and Cu bonding...