Jang-Kyu Kang

Person

Dacjeon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for mobile satellite communications and method of control...
- Patent number 8,411,614
- Issue date Apr 2, 2013
- Electronics and Telecommunications Research Institute
- Min Su Shin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board with embedded capacitors therein, and process...
- Patent number 7,570,491
- Issue date Aug 4, 2009
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder resist pattern
- Patent number 7,435,352
- Issue date Oct 14, 2008
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded capacitors and manufacturing me...
- Patent number 7,326,858
- Issue date Feb 5, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing printed circuit board with embedded resistor
- Patent number 7,284,317
- Issue date Oct 23, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Suk-Hyun Cho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded capacitors therein, and process...
- Patent number 7,092,237
- Issue date Aug 15, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Weak-magnetic field sensor using printed circuit board technology a...
- Patent number 7,015,691
- Issue date Mar 21, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board with embedded capacitors therein, and process...
- Patent number 6,910,266
- Issue date Jun 28, 2005
- Samsung Electro-Mechanics Co., Ltd.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing high performance ball grid array board and jig...
- Patent number 6,755,229
- Issue date Jun 29, 2004
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR PROCESSING DATA
- Publication number 20140082674
- Publication date Mar 20, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Min Su SHIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS FOR MOBILE SATELLITE COMMUNICATIONS AND METHOD OF CONTROL...
- Publication number 20100135198
- Publication date Jun 3, 2010
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Min Su SHIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS...
- Publication number 20090325105
- Publication date Dec 31, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-sided printed circuit board without via holes and method of...
- Publication number 20050284657
- Publication date Dec 29, 2005
- SUMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang-Sup Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with embedded capacitors therein, and process...
- Publication number 20050199681
- Publication date Sep 15, 2005
- Samsung Electro-Mechanics CO., LTD.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing printed circuit board with embedded resistor
- Publication number 20050175385
- Publication date Aug 11, 2005
- Samsung Electro-Mechanics CO., LTD.
- Suk-Hyun Cho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming solder resist pattern
- Publication number 20040248410
- Publication date Dec 9, 2004
- Samsung Electro-Mechanics CO., LTD.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating multi-layered printed circuit board
- Publication number 20040194303
- Publication date Oct 7, 2004
- Samsung Electro-Mechanics CO., LTD.
- Eung-Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-sided printed circuit board without via holes and method of...
- Publication number 20040124003
- Publication date Jul 1, 2004
- Chang-Sup Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Weak-magnetic field sensor using printed circuit board technology a...
- Publication number 20040124836
- Publication date Jul 1, 2004
- Myung-Sam Kang
- G01 - MEASURING TESTING
Information Patent Application
Printed circuit board with embedded capacitors and manufacturing me...
- Publication number 20040118602
- Publication date Jun 24, 2004
- Samsung Electro-Mechanics CO., LTD.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with embedded capacitors therein, and process...
- Publication number 20040118600
- Publication date Jun 24, 2004
- Samsung Electro-Mechanics CO., LTD.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with embedded capacitors therein, and process...
- Publication number 20040121266
- Publication date Jun 24, 2004
- Samsung Electro-Mechanics CO., LTD.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with buried resistor and manufacturing method...
- Publication number 20030150101
- Publication date Aug 14, 2003
- Samsung Electro-Mechanics CO., LTD.
- Keon-Yang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing high performance ball grid array board and jig...
- Publication number 20030019574
- Publication date Jan 30, 2003
- Myung-Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS

Jang-Kyu Kang

Person

Patents Grantslast 30 patents

Apparatus for mobile satellite communications and method of control...

Printed circuit board with embedded capacitors therein, and process...

Method of forming solder resist pattern

Printed circuit board with embedded capacitors and manufacturing me...

Method of producing printed circuit board with embedded resistor

Printed circuit board with embedded capacitors therein, and process...

Weak-magnetic field sensor using printed circuit board technology a...

Printed circuit board with embedded capacitors therein, and process...

Method for preparing high performance ball grid array board and jig...

Patents Applicationslast 30 patents

APPARATUS, SYSTEM, AND METHOD FOR PROCESSING DATA

APPARATUS FOR MOBILE SATELLITE COMMUNICATIONS AND METHOD OF CONTROL...

PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS...

Double-sided printed circuit board without via holes and method of...

Printed circuit board with embedded capacitors therein, and process...

Method of producing printed circuit board with embedded resistor

Method of forming solder resist pattern

Method of fabricating multi-layered printed circuit board

Double-sided printed circuit board without via holes and method of...

Weak-magnetic field sensor using printed circuit board technology a...

Printed circuit board with embedded capacitors and manufacturing me...

Printed circuit board with embedded capacitors therein, and process...

Printed circuit board with embedded capacitors therein, and process...

Printed circuit board with buried resistor and manufacturing method...

Method for preparing high performance ball grid array board and jig...