Janggeun LEE

Person

Delmar, NY, US

People

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...
- Publication number 20230369111
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING VIA STRUCTURES HAVING A NARROW...
- Publication number 20230352400
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Tae Sun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM...
- Publication number 20230352405
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Janggeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...
- Publication number 20230352399
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING METAL PATT...
- Publication number 20230343698
- Publication date Oct 26, 2023
- SAMSUNG ELECTRONICS CO,. LTD.
- Jaemyung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SPACER VIA STRUCTURE AND METHOD OF M...
- Publication number 20230343697
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Janggeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED ELEMENTS AND METHODS O...
- Publication number 20230275021
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- BYOUNGHAK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUPER VIA STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230253327
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Janggeun LEE
- H01 - BASIC ELECTRIC ELEMENTS

Janggeun LEE

Person

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...

INTEGRATED CIRCUIT DEVICES INCLUDING VIA STRUCTURES HAVING A NARROW...

INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM...

INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...

INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING METAL PATT...

SEMICONDUCTOR DEVICE INCLUDING SPACER VIA STRUCTURE AND METHOD OF M...

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED ELEMENTS AND METHODS O...

HYBRID SUPER VIA STRUCTURE AND METHOD OF MANUFACTURING THE SAME