Jangshen LIN

Person

Jiangyin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including antenna
- Patent number 11,728,558
- Issue date Aug 15, 2023
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,699,840
- Issue date Jul 11, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,515,269
- Issue date Nov 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 11,502,392
- Issue date Nov 15, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,488,915
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 11,437,707
- Issue date Sep 6, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens antenna packaging structure, preparation method and electronic...
- Patent number 11,322,852
- Issue date May 3, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,316,247
- Issue date Apr 26, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,289,793
- Issue date Mar 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,283,152
- Issue date Mar 22, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation method thereof
- Patent number 11,257,772
- Issue date Feb 22, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,228,087
- Issue date Jan 18, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor structure with an antenna module
- Patent number 11,211,687
- Issue date Dec 28, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,114,391
- Issue date Sep 7, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 10,886,594
- Issue date Jan 5, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation thereof
- Patent number 10,886,243
- Issue date Jan 5, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation method thereof
- Patent number 10,872,867
- Issue date Dec 22, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation method thereof
- Patent number 10,872,868
- Issue date Dec 22, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 10,854,951
- Issue date Dec 1, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 10,777,876
- Issue date Sep 15, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation method thereof
- Patent number 10,777,515
- Issue date Sep 15, 2020
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor packaging structure with antenna module and m...
- Patent number 10,770,394
- Issue date Sep 8, 2020
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and method making the same
- Patent number 10,714,435
- Issue date Jul 14, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device for integrated power supply system and packaging m...
- Patent number 10,636,779
- Issue date Apr 28, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation thereof
- Patent number 10,573,609
- Issue date Feb 25, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided plastic fan-out package structure having antenna and m...
- Patent number 10,325,786
- Issue date Jun 18, 2019
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...
- Publication number 20220415803
- Publication date Dec 29, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...
- Publication number 20220415816
- Publication date Dec 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20220102837
- Publication date Mar 31, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20220093415
- Publication date Mar 24, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AN ANTENNA AND METHOD MAKING THE SAME
- Publication number 20220077567
- Publication date Mar 10, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20210249370
- Publication date Aug 12, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS ANTENNA PACKAGING STRUCTURE, PREPARATION METHOD AND ELECTRONIC...
- Publication number 20210203078
- Publication date Jul 1, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Packaging Method for Antenna
- Publication number 20210083362
- Publication date Mar 18, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20210036406
- Publication date Feb 4, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Feeder Package Structure and Packaging Method
- Publication number 20200411948
- Publication date Dec 31, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20200373262
- Publication date Nov 26, 2020
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF
- Publication number 20200075515
- Publication date Mar 5, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Package Structure And Antenna Packaging Method
- Publication number 20190348380
- Publication date Nov 14, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20190333881
- Publication date Oct 31, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20190333879
- Publication date Oct 31, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20190333880
- Publication date Oct 31, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20190288373
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure And Packaging Method For Antenna
- Publication number 20190288370
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20190288372
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA FEEDER PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20190288374
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE
- Publication number 20190181534
- Publication date Jun 13, 2019
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE
- Publication number 20190181535
- Publication date Jun 13, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGING STRUCTURE WITH ANTENNA MODULE AND M...
- Publication number 20190181085
- Publication date Jun 13, 2019
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ANTENNA AND METHOD MAKING THE SAME
- Publication number 20190181536
- Publication date Jun 13, 2019
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED PLASTIC FAN-OUT PACKAGE STRUCTURE HAVING ANTENNA AND M...
- Publication number 20190181104
- Publication date Jun 13, 2019
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE
- Publication number 20190181105
- Publication date Jun 13, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20190172803
- Publication date Jun 6, 2019
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF
- Publication number 20190172802
- Publication date Jun 6, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Jangshen LIN

Person

Patents Grantslast 30 patents

Packaging structure and method for preparing same

Semiconductor structure including antenna

Antenna package structure and antenna packaging method

Semiconductor packaging structure having antenna module

Packaging structure and packaging method for antenna

Antenna package structure and antenna packaging method

Antenna feeder package structure and packaging method

Lens antenna packaging structure, preparation method and electronic...

Semiconductor packaging structure having antenna module

Semiconductor packaging structure having antenna module

Antenna package structure and antenna packaging method

Fan-out antenna packaging structure and preparation method thereof

Antenna package structure and antenna packaging method

Method of fabricating a semiconductor structure with an antenna module

Antenna package structure and antenna packaging method

Packaging structure and packaging method for antenna

Fan-out antenna packaging structure and preparation thereof

Fan-out antenna packaging structure and preparation method thereof

Fan-out antenna packaging structure and preparation method thereof

Antenna package structure and antenna packaging method

Antenna feeder package structure and packaging method

Fan-out antenna packaging structure and preparation method thereof

Fan-out semiconductor packaging structure with antenna module and m...

Fan-out antenna packaging structure and method making the same

Packaging device for integrated power supply system and packaging m...

Fan-out antenna packaging structure and preparation thereof

Double-sided plastic fan-out package structure having antenna and m...

Patents Applicationslast 30 patents

WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...

WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME

SEMICONDUCTOR STRUCTURE WITH AN ANTENNA AND METHOD MAKING THE SAME

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

LENS ANTENNA PACKAGING STRUCTURE, PREPARATION METHOD AND ELECTRONIC...

Packaging Structure and Packaging Method for Antenna

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

Antenna Feeder Package Structure and Packaging Method

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF

Antenna Package Structure And Antenna Packaging Method

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

Packaging Structure And Packaging Method For Antenna

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

ANTENNA FEEDER PACKAGE STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE

SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE

FAN-OUT SEMICONDUCTOR PACKAGING STRUCTURE WITH ANTENNA MODULE AND M...

SEMICONDUCTOR STRUCTURE WITH ANTENNA AND METHOD MAKING THE SAME

DOUBLE-SIDED PLASTIC FAN-OUT PACKAGE STRUCTURE HAVING ANTENNA AND M...

SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE

FAN-OUT ANTENNA PACKAGING STRUCTURE AND METHOD MAKING THE SAME

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF