Jani Miettinen

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Hyvinkaa, FI

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Patents Applicationslast 30 patents

Information Patent Application
Electronics Package And Manufacturing Method Thereof
- Publication number 20080186690
- Publication date Aug 7, 2008
- Nokia Corporation
- Jani Miettinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Of Electronics Package
- Publication number 20080176359
- Publication date Jul 24, 2008
- Nokia Corporation
- Petri Molkkari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Bump Manufacturing Using Conductive Ink
- Publication number 20080171450
- Publication date Jul 17, 2008
- Nokia Corporation
- Petri Molkkari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Die Attachment
- Publication number 20080169574
- Publication date Jul 17, 2008
- Nokia Corporation
- Petri Molkkari
- H01 - BASIC ELECTRIC ELEMENTS