Janis Horvath

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for fluid ejection devices
- Patent number 6,997,540
- Issue date Feb 14, 2006
- Hewlett-Packard Development Company, L.P.
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Edge-sealed substrates and methods for effecting the same
- Patent number 6,951,778
- Issue date Oct 4, 2005
- Hewlett-Packard Development Company, L.P.
- Mohammad Akhavain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming substrate with fluid passage supports
- Patent number 6,880,246
- Issue date Apr 19, 2005
- Hewlett-Packard Development Company, L.P.
- Janis Horvath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit for printhead assembly
- Patent number 6,843,552
- Issue date Jan 18, 2005
- Hewlett-Packard Development Company, L.P.
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Substrate for fluid ejection devices
- Patent number 6,705,705
- Issue date Mar 16, 2004
- Hewlett-Packard Development Company, L.P.
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Surface deformation of carrier for printhead dies
- Patent number 6,679,581
- Issue date Jan 20, 2004
- Hewlett-Packard Development Company, L.P.
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Joining of different materials of carrier for fluid ejection devices
- Patent number 6,575,559
- Issue date Jun 10, 2003
- Hewlett-Packard Development Company, L.P.
- David K McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electrical circuit for wide-array inkjet printhead assembly
- Patent number 6,557,976
- Issue date May 6, 2003
- Hewlett-Packard Development Company, L.P.
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inkjet printhead assembly having planarized mounting layer for prin...
- Patent number 6,543,880
- Issue date Apr 8, 2003
- Hewlett-Packard Company
- Mohammad Akhavain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for fluid ejection device
- Patent number 6,523,940
- Issue date Feb 25, 2003
- Hewlett-Packard Company
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Substrate with fluid passage supports
- Patent number 6,520,624
- Issue date Feb 18, 2003
- Hewlett-Packard Company
- Janis Horvath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet printhead assembly with hybrid carrier for printhead dies
- Patent number 6,464,333
- Issue date Oct 15, 2002
- Hewlett-Packard Company
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead die alignment for wide-array inkjet printhead assembly
- Patent number 6,450,614
- Issue date Sep 17, 2002
- Hewlett-Packard Company
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Hybrid carrier for wide-array inkjet printhead assembly
- Patent number 6,431,683
- Issue date Aug 13, 2002
- Hewlett-Packard Company
- May Fong Ho
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Coplanar mounting of printhead dies for wide-array inkjet printhead...
- Patent number 6,409,307
- Issue date Jun 25, 2002
- Hewlett-Packard Company
- Mohammad Akhavain
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Carrier positioning for wide-array inkjet printhead assembly
- Patent number 6,350,013
- Issue date Feb 26, 2002
- Hewlett-Packard Company
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electrical connection for wide-array inkjet printhead assembly with...
- Patent number 6,341,845
- Issue date Jan 29, 2002
- Hewlett-Packard Company
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Substrate for fluid ejection devices
- Publication number 20040100522
- Publication date May 27, 2004
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Edge-sealed substrates and methods for effecting the same
- Publication number 20040087063
- Publication date May 6, 2004
- Mohammad Akhavin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of forming substrate with fluid passage supports
- Publication number 20030231229
- Publication date Dec 18, 2003
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Electrical circuit for printhead assembly
- Publication number 20030202047
- Publication date Oct 30, 2003
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Joining of different materials of carrier for printhead dies
- Publication number 20030081058
- Publication date May 1, 2003
- David K. McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Surface deformation of carrier for printhead dies
- Publication number 20030081059
- Publication date May 1, 2003
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Substrate for fluid ejection devices
- Publication number 20030007034
- Publication date Jan 9, 2003
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRICAL CIRCUIT FOR WIDE-ARRAY INKJET PRINTHEAD ASSEMBLY
- Publication number 20020109751
- Publication date Aug 15, 2002
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Electrical connection for wide-array inkjet printhead assembly with...
- Publication number 20020051036
- Publication date May 2, 2002
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Janis Horvath

Person

Patents Grantslast 30 patents

Substrate for fluid ejection devices

Edge-sealed substrates and methods for effecting the same

Method of forming substrate with fluid passage supports

Electrical circuit for printhead assembly

Substrate for fluid ejection devices

Surface deformation of carrier for printhead dies

Joining of different materials of carrier for fluid ejection devices

Electrical circuit for wide-array inkjet printhead assembly

Inkjet printhead assembly having planarized mounting layer for prin...

Carrier for fluid ejection device

Substrate with fluid passage supports

Inkjet printhead assembly with hybrid carrier for printhead dies

Printhead die alignment for wide-array inkjet printhead assembly

Hybrid carrier for wide-array inkjet printhead assembly

Coplanar mounting of printhead dies for wide-array inkjet printhead...

Carrier positioning for wide-array inkjet printhead assembly

Electrical connection for wide-array inkjet printhead assembly with...

Patents Applicationslast 30 patents

Substrate for fluid ejection devices

Edge-sealed substrates and methods for effecting the same

Method of forming substrate with fluid passage supports

Electrical circuit for printhead assembly

Joining of different materials of carrier for printhead dies

Surface deformation of carrier for printhead dies

Substrate for fluid ejection devices

ELECTRICAL CIRCUIT FOR WIDE-ARRAY INKJET PRINTHEAD ASSEMBLY

Electrical connection for wide-array inkjet printhead assembly with...