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Jansen Chiu
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Kaohsiung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-chip package
Patent number
6,744,121
Issue date
Jun 1, 2004
Walton Advanced Electronics Ltd.
Cecil Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package
Patent number
6,483,181
Issue date
Nov 19, 2002
Walton Advanced Electronics Ltd.
Cecil Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Process for making a ball grid array semiconductor package
Publication number
20030100174
Publication date
May 29, 2003
Walsin Advanced Electronics LTD
Jansen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable-type semiconductor package
Publication number
20030038347
Publication date
Feb 27, 2003
Walton Advanced Electronics LTD
Jansen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package without outer leads
Publication number
20030038358
Publication date
Feb 27, 2003
Walton Advanced Electronics LTD
Jansen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip scale package with a small surface mounting area
Publication number
20030037947
Publication date
Feb 27, 2003
Walton Advance Electronics LTD
Jansen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE
Publication number
20020153601
Publication date
Oct 24, 2002
Walton Advanced Electronics LTD
Cecil Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip package
Publication number
20020153599
Publication date
Oct 24, 2002
Walton Advanced Electronics LTD
Cecil Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Double sided chip package
Publication number
20020153600
Publication date
Oct 24, 2002
Walton Advanced Electronics LTD
Cecil Chang
H01 - BASIC ELECTRIC ELEMENTS