Jar-Dar Yang

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip stack package structure
- Patent number 8,269,351
- Issue date Sep 18, 2012
- ChipMOS Technologies Inc.
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stack package structure
- Patent number 8,269,352
- Issue date Sep 18, 2012
- ChipMOS Technologies Inc.
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stack package structure
- Patent number 8,264,068
- Issue date Sep 11, 2012
- ChipMOS Technologies Inc.
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20130069228
- Publication date Mar 21, 2013
- An-Hong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack package structure
- Publication number 20110309497
- Publication date Dec 22, 2011
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack package structure
- Publication number 20110309496
- Publication date Dec 22, 2011
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack package structure
- Publication number 20110309495
- Publication date Dec 22, 2011
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS