Jari Hiltunen

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Mouhijarvi, FI

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Patents Grantslast 30 patents

Information Patent Grant
Reflowable camera module with integrated flash
- Patent number 8,130,312
- Issue date Mar 6, 2012
- OmniVision Technologies, Inc.
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer chip scale package
- Patent number 7,939,940
- Issue date May 10, 2011
- OmniVision Technologies, Inc.
- Jari Hiltunen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable camera module with improved reliability of solder connec...
- Patent number 7,911,019
- Issue date Mar 22, 2011
- OmniVision Technologies, Inc.
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensing devices, image sensor modules, and associated methods
- Patent number 7,268,335
- Issue date Sep 11, 2007
- OmniVision Technologies, Inc.
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Reflowable Camera Module With Improved Reliability Of Solder Connec...
- Publication number 20100171192
- Publication date Jul 8, 2010
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REFLOWABLE CAMERA MODULE WITH IMPROVED RELIABILITY OF SOLDER CONNEC...
- Publication number 20090152659
- Publication date Jun 18, 2009
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTILAYER CHIP SCALE PACKAGE
- Publication number 20090152720
- Publication date Jun 18, 2009
- Jari Hiltunen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflowable Camera Module With Integrated Flash
- Publication number 20090153729
- Publication date Jun 18, 2009
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensing devices, image sensor modules, and associated methods
- Publication number 20070176086
- Publication date Aug 2, 2007
- OmniVision Technologies, Inc.
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Coated wafer level camera modules and associated methods
- Publication number 20070052827
- Publication date Mar 8, 2007
- OmniVision Technologies, Inc.
- Jari Hiltunen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE