Jaroslaw W. Winniczek

Person

Daly City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Image quality detection and correction system
- Patent number 11,303,868
- Issue date Apr 12, 2022
- CAPTUREPROOF, INC.
- Jaroslaw Walery Winniczek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image quality detection and correction system
- Patent number 11,050,984
- Issue date Jun 29, 2021
- CAPTUREPROOF, INC.
- Jaroslaw Walery Winniczek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabrication of a silicon structure and deep silicon etch with profi...
- Patent number 9,865,472
- Issue date Jan 9, 2018
- Lam Research Corporation
- Robert Chebi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of a silicon structure and deep silicon etch with profi...
- Patent number 9,330,926
- Issue date May 3, 2016
- Lam Research Corporation
- Robert Chebi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon etch with passivation using chemical vapor deposition
- Patent number 9,018,098
- Issue date Apr 28, 2015
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for achieving smooth side walls after Bosch etch process
- Patent number 8,871,105
- Issue date Oct 28, 2014
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing photoresist
- Patent number 8,757,178
- Issue date Jun 24, 2014
- Lam Research Corporation
- Robert P. Chebi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for providing high etch rate
- Patent number 8,609,548
- Issue date Dec 17, 2013
- Lam Research Corporation
- Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon etch with passivation using plasma enhanced oxidation
- Patent number 8,598,037
- Issue date Dec 3, 2013
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High strip rate downstream chamber
- Patent number 8,425,682
- Issue date Apr 23, 2013
- Lam Research Corporation
- Ing-Yann Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High strip rate downstream chamber
- Patent number 8,298,336
- Issue date Oct 30, 2012
- Lam Research Corporation
- Ing-Yann Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silicon etch with passivation using plasma enhanced oxidation
- Patent number 8,173,547
- Issue date May 8, 2012
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing photoresist
- Patent number 8,043,434
- Issue date Oct 25, 2011
- Lam Research Corporation
- Robert P. Chebi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photoresist stripping chamber and methods of etching photoresist on...
- Patent number 7,605,063
- Issue date Oct 20, 2009
- Lam Research Corporation
- Robert P. Chebi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method and apparatus for in-situ substrate inspection
- Patent number 7,542,134
- Issue date Jun 2, 2009
- Lam Research Corporation
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Grant
System, method and apparatus for in-situ substrate inspection
- Patent number 7,397,555
- Issue date Jul 8, 2008
- Lam Research Corporation
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Grant
Full spectrum endpoint detection
- Patent number 6,969,619
- Issue date Nov 29, 2005
- Novellus Systems, Inc.
- Jaroslaw W. Winniczek
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for determining an etch endpoint in a plasma...
- Patent number 6,562,187
- Issue date May 13, 2003
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing mask erosion during plasma etching
- Patent number 6,489,245
- Issue date Dec 3, 2002
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for running a high density plasma etcher to achieve reduced...
- Patent number 6,255,221
- Issue date Jul 3, 2001
- Lam Research Corporation
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for determining an etch endpoint in a plasma...
- Patent number 6,228,278
- Issue date May 8, 2001
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing mask erosion during plasma etching
- Patent number 6,093,332
- Issue date Jul 25, 2000
- Lam Research Corporation
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION OF A SILICON STRUCTURE AND DEEP SILICON ETCH WITH PROFI...
- Publication number 20160233102
- Publication date Aug 11, 2016
- LAM RESEARCH CORPORATION
- Robert CHEBI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH STRIP RATE DOWNSTREAM CHAMBER
- Publication number 20140261803
- Publication date Sep 18, 2014
- Ing-Yann Wang
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
METHOD FOR ACHIEVING SMOOTH SIDE WALLS AFTER BOSCH ETCH PROCESS
- Publication number 20130237062
- Publication date Sep 12, 2013
- Jaroslaw W. Winniczek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE CONTROL VALVE ASSEMBLY OF PLASMA PROCESSING CHAMBER AND RA...
- Publication number 20130203259
- Publication date Aug 8, 2013
- LAM RESEARCH CORPORATION
- Jaroslaw W Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH STRIP RATE DOWNSTREAM CHAMBER
- Publication number 20130025693
- Publication date Jan 31, 2013
- LAM RESEARCH CORPORATION
- Ing-Yann Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING HIGH ETCH RATE
- Publication number 20120309194
- Publication date Dec 6, 2012
- LAM RESEARCH CORPORATION
- Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ETCH WITH PASSIVATION USING PLASMA ENHANCED OXIDATION
- Publication number 20120100720
- Publication date Apr 26, 2012
- LAM RESEARCH CORPORATION
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REMOVING PHOTORESIST
- Publication number 20120006486
- Publication date Jan 12, 2012
- LAM RESEARCH CORPORATION
- Robert P. Chebi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND APPARATUS FOR REMOVING PHOTORESIST
- Publication number 20100101603
- Publication date Apr 29, 2010
- LAM RESEARCH CORPORATION
- Robert P. Chebi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SILICON ETCH WITH PASSIVATION USING CHEMICAL VAPOR DEPOSITION
- Publication number 20100105208
- Publication date Apr 29, 2010
- LAM RESEARCH CORPORATION
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ETCH WITH PASSIVATION USING PLASMA ENHANCED OXIDATION
- Publication number 20100105209
- Publication date Apr 29, 2010
- LAM RESEARCH CORPORATION
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A SILICON STRUCTURE AND DEEP SILICON ETCH WITH PROFI...
- Publication number 20090184089
- Publication date Jul 23, 2009
- LAM RESEARCH CORPORATION
- Robert CHEBI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION
- Publication number 20080273195
- Publication date Nov 6, 2008
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Application
Photoresist stripping chamber and methods of etching photoresist on...
- Publication number 20070264841
- Publication date Nov 15, 2007
- Lam Research Corporation
- Robert P. Chebi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High strip rate downstream chamber
- Publication number 20060219361
- Publication date Oct 5, 2006
- Lam Research Corporation
- Ing-Yann Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, method and apparatus for in-situ substrate inspection
- Publication number 20060139450
- Publication date Jun 29, 2006
- Lam Research Corp.
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for determining an etch endpoint in a plasma...
- Publication number 20030183335
- Publication date Oct 2, 2003
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for running a high density plasma etcher to achieve reduced...
- Publication number 20020029853
- Publication date Mar 14, 2002
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for determining an etch endpoint in a plasma...
- Publication number 20010004921
- Publication date Jun 28, 2001
- Jaroslaw W. Winniczek
- H01 - BASIC ELECTRIC ELEMENTS

Jaroslaw W. Winniczek

Person

Patents Grantslast 30 patents

Image quality detection and correction system

Image quality detection and correction system

Fabrication of a silicon structure and deep silicon etch with profi...

Fabrication of a silicon structure and deep silicon etch with profi...

Silicon etch with passivation using chemical vapor deposition

Method for achieving smooth side walls after Bosch etch process

Method and apparatus for removing photoresist

Method for providing high etch rate

Silicon etch with passivation using plasma enhanced oxidation

High strip rate downstream chamber

High strip rate downstream chamber

Silicon etch with passivation using plasma enhanced oxidation

Method and apparatus for removing photoresist

Photoresist stripping chamber and methods of etching photoresist on...

System, method and apparatus for in-situ substrate inspection

System, method and apparatus for in-situ substrate inspection

Full spectrum endpoint detection

Methods and apparatus for determining an etch endpoint in a plasma...

Methods for reducing mask erosion during plasma etching

Methods for running a high density plasma etcher to achieve reduced...

Methods and apparatus for determining an etch endpoint in a plasma...

Methods for reducing mask erosion during plasma etching

Patents Applicationslast 30 patents

FABRICATION OF A SILICON STRUCTURE AND DEEP SILICON ETCH WITH PROFI...

HIGH STRIP RATE DOWNSTREAM CHAMBER

METHOD FOR ACHIEVING SMOOTH SIDE WALLS AFTER BOSCH ETCH PROCESS

PRESSURE CONTROL VALVE ASSEMBLY OF PLASMA PROCESSING CHAMBER AND RA...

HIGH STRIP RATE DOWNSTREAM CHAMBER

METHOD FOR PROVIDING HIGH ETCH RATE

SILICON ETCH WITH PASSIVATION USING PLASMA ENHANCED OXIDATION

METHOD AND APPARATUS FOR REMOVING PHOTORESIST

METHOD AND APPARATUS FOR REMOVING PHOTORESIST

SILICON ETCH WITH PASSIVATION USING CHEMICAL VAPOR DEPOSITION

SILICON ETCH WITH PASSIVATION USING PLASMA ENHANCED OXIDATION

FABRICATION OF A SILICON STRUCTURE AND DEEP SILICON ETCH WITH PROFI...

SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION

Photoresist stripping chamber and methods of etching photoresist on...

High strip rate downstream chamber

System, method and apparatus for in-situ substrate inspection

Methods and apparatus for determining an etch endpoint in a plasma...

Methods for running a high density plasma etcher to achieve reduced...

Methods and apparatus for determining an etch endpoint in a plasma...