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Jason Alexander VARNELL

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  • Tigard, OR, US
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Patents Applicationslast 30 patents

  • Information Patent Application

    SEAM-FREE AND CRACK-FREE DEPOSITION
    • Publication number 20250188609
    • Publication date Jun 12, 2025
    • LAM RESEARCH CORPORATION
    • Awnish Gupta
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    THERMAL FILM DEPOSITION
    • Publication number 20250166989
    • Publication date May 22, 2025
    • LAM RESEARCH CORPORATION
    • Jason Alexander Varnell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH PRESSURE INERT OXIDATION AND IN-SITU ANNEALING PROCESS TO IMPR...
    • Publication number 20250154644
    • Publication date May 15, 2025
    • LAM RESEARCH CORPORATION
    • Eli Jeon
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    IMPURITY REDUCTION IN SILICON-CONTAINING FILMS
    • Publication number 20230317449
    • Publication date Oct 5, 2023
    • LAM RESEARCH CORPORATION
    • Awnish Gupta
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    CONFORMAL THERMAL CVD WITH CONTROLLED FILM PROPERTIES AND HIGH DEPO...
    • Publication number 20230245896
    • Publication date Aug 3, 2023
    • LAM RESEARCH CORPORATION
    • Awnish Gupta
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION
    • Publication number 20230154754
    • Publication date May 18, 2023
    • LAM RESEARCH CORPORATION
    • Jason Alexander VARNELL
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...