Jason An-Cheng Huang

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Motor control device with built-in current sensing resistor and pow...
- Patent number 11,043,911
- Issue date Jun 22, 2021
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board with built-in vertical heat dissipation ceram...
- Patent number 10,524,349
- Issue date Dec 31, 2019
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...
- Publication number 20250132233
- Publication date Apr 24, 2025
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD AND MOLD THEREOF
- Publication number 20240290697
- Publication date Aug 29, 2024
- SENTEC E&E CO., LTD.
- Jason HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER APPARATUS
- Publication number 20240203852
- Publication date Jun 20, 2024
- SENTEC E&E CO., LTD.
- Jason HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER APPARATUS WITH ELECTROMAGNETIC INTERFERENCE REDUCTION FUNCTION
- Publication number 20240178748
- Publication date May 30, 2024
- SENTEC E&E CO., LTD.
- Jason HUANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Thermal Conduction - Electrical Conduction Isolated Circuit Board w...
- Publication number 20240114614
- Publication date Apr 4, 2024
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Parasitic Inductance Power Module Featuring Staggered, interlea...
- Publication number 20240063726
- Publication date Feb 22, 2024
- Sentec E&E Co., Ltd.
- Jason An Cheng HUANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Low Parasitic Inductance Power Module Having Staggered, Interleavin...
- Publication number 20240063149
- Publication date Feb 22, 2024
- Sentec E&E Co., Ltd.
- Jason An Cheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230396187
- Publication date Dec 7, 2023
- SENTEC E&E CO., LTD.
- Jason An Cheng Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver
- Publication number 20230378145
- Publication date Nov 23, 2023
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Parasitic Inductance Power Module Featuring Staggered Interleav...
- Publication number 20230215789
- Publication date Jul 6, 2023
- Sentec E&E Co., Ltd.
- Jason An Cheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Motor Control Device with Built-in Current Sensing Resistor and Pow...
- Publication number 20200186067
- Publication date Jun 11, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Printed Circuit Board with Built-In Vertical Heat Dissipation Ceram...
- Publication number 20180352646
- Publication date Dec 6, 2018
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H01 - BASIC ELECTRIC ELEMENTS

Jason An-Cheng Huang

Person

Patents Grantslast 30 patents

Motor control device with built-in current sensing resistor and pow...

Printed circuit board with built-in vertical heat dissipation ceram...

Patents Applicationslast 30 patents

Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...

POWER MODULE AND MANUFACTURING METHOD AND MOLD THEREOF

POWER APPARATUS

POWER APPARATUS WITH ELECTROMAGNETIC INTERFERENCE REDUCTION FUNCTION

Thermal Conduction - Electrical Conduction Isolated Circuit Board w...

Low Parasitic Inductance Power Module Featuring Staggered, interlea...

Low Parasitic Inductance Power Module Having Staggered, Interleavin...

POWER MODULE

Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver

Low Parasitic Inductance Power Module Featuring Staggered Interleav...

Motor Control Device with Built-in Current Sensing Resistor and Pow...

Printed Circuit Board with Built-In Vertical Heat Dissipation Ceram...