Jason Binay-an Colte

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Benguet, PH

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for making integrated circuit packages
- Patent number 11,152,324
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SECURITY WIRE OVER STITCH BOND
- Publication number 20240128228
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aniceto Rabilas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK ARREST FEATURES FOR MIULTILEVEL PACKAGE SUBSTRATE
- Publication number 20240063107
- Publication date Feb 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jason Colte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT
- Publication number 20230378146
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
- Publication number 20180033758
- Publication date Feb 1, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
- Publication number 20160276185
- Publication date Sep 22, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS