Jason CHEN

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Tao Yuan Shien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Structure of backside copper metallization for semiconductor device...
- Patent number 9,548,276
- Issue date Jan 17, 2017
- WIN SEMICONDUCTORS CORP.
- Jason Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating apparatus and method
- Patent number 8,911,551
- Issue date Dec 16, 2014
- WIN Semiconductor Corp.
- Jason Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...
- Publication number 20160020178
- Publication date Jan 21, 2016
- WIN SEMICONDUCTORS CORP.
- Jason CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...
- Publication number 20130277845
- Publication date Oct 24, 2013
- WIN SEMICONDUCTORS CORP.
- Jason CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING APPARATUS AND METHOD
- Publication number 20130034959
- Publication date Feb 7, 2013
- Jason CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...