Jason E. Tripard

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package separators
- Patent number 7,513,182
- Issue date Apr 7, 2009
- Micron Technology, Inc.
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package separators
- Patent number 7,367,252
- Issue date May 6, 2008
- Micron Technology, Inc.
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package separator methods
- Patent number 7,276,397
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package separators
- Patent number 6,945,151
- Issue date Sep 20, 2005
- Micron Technology, Inc.
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package separators
- Patent number 6,920,815
- Issue date Jul 26, 2005
- Micron Technology, Inc.
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package separators
- Patent number 6,718,858
- Issue date Apr 13, 2004
- Micron Technology, Inc.
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package separators
- Patent number 6,508,154
- Issue date Jan 21, 2003
- Micron Technology, Inc.
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming integrated circuit packages
- Patent number 6,277,671
- Issue date Aug 21, 2001
- Micron Technology, Inc.
- Jason E. Tripard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit package separators
- Publication number 20050284274
- Publication date Dec 29, 2005
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package separators
- Publication number 20050278944
- Publication date Dec 22, 2005
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package separator methods
- Publication number 20040157411
- Publication date Aug 12, 2004
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package separators
- Publication number 20040154451
- Publication date Aug 12, 2004
- Jason E. Tripard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SEPARATORS
- Publication number 20010052278
- Publication date Dec 20, 2001
- Jason E. Tripard
- H01 - BASIC ELECTRIC ELEMENTS

Jason E. Tripard

Person

Patents Grantslast 30 patents

Integrated circuit package separators

Integrated circuit package separators

Integrated circuit package separator methods

Integrated circuit package separators

Integrated circuit package separators

Integrated circuit package separators

Integrated circuit package separators

Methods of forming integrated circuit packages

Patents Applicationslast 30 patents

Integrated circuit package separators

Integrated circuit package separators

Integrated circuit package separator methods

Integrated circuit package separators

INTEGRATED CIRCUIT PACKAGE SEPARATORS