Jason KELEHER

Person

Joliet, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-passivating CMP compositions and methods
- Patent number 8,435,421
- Issue date May 7, 2013
- Cabot Microelectronics Corporation
- Jason Keleher
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper-passivating CMP compositions and methods
- Patent number 7,955,520
- Issue date Jun 7, 2011
- Cabot Microelectronics Corporation
- Daniela White
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Compositions and methods for CMP of low-k-dielectric materials
- Patent number 7,456,107
- Issue date Nov 25, 2008
- Cabot Microelectronics Corporation
- Jason Keleher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-chemical remediation of Cu-CMP waste
- Patent number 6,916,428
- Issue date Jul 12, 2005
- Amia Corporation
- Yuzhuo Li
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method of fabricating a copper damascene structure
- Patent number 6,660,639
- Issue date Dec 9, 2003
- Ferro Corporation
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silica-based slurry
- Patent number 6,656,241
- Issue date Dec 2, 2003
- PPG Industries Ohio, Inc.
- Stuart D. Hellring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical-mechanical polishing copper damascene structures
- Patent number 6,508,953
- Issue date Jan 21, 2003
- Ferro Corporation
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diamond slurry for chemical-mechanical planarization of semiconduct...
- Patent number 6,258,721
- Issue date Jul 10, 2001
- General Electric Company
- Yuzhuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond slurry for chemical-mechanical planarization of semiconduct...
- Patent number 6,242,351
- Issue date Jun 5, 2001
- General Electric Company
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANT
- Publication number 20110247996
- Publication date Oct 13, 2011
- Cabot Microelectronics Corporation
- Francesco De Rege Thesauro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL-PASSIVATING CMP COMPOSITIONS AND METHODS
- Publication number 20110100956
- Publication date May 5, 2011
- Cabot Microelectronics Corporation
- Jason KELEHER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Copper-passivating CMP compositions and methods
- Publication number 20090134122
- Publication date May 28, 2009
- Daniela White
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper CMP composition containing ionic polyelectrolyte and method
- Publication number 20090056231
- Publication date Mar 5, 2009
- Daniela White
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANT
- Publication number 20080203059
- Publication date Aug 28, 2008
- Cabot Microelectronics Corporation
- Francesco De Rege Thesauro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Compositions and methods for CMP of low-k-dielectric materials
- Publication number 20080111101
- Publication date May 15, 2008
- Jason Keleher
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICALLY MODIFIED CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20080034670
- Publication date Feb 14, 2008
- PPG INDUSTRIES OHIO, INC.
- Yuzhuo Li
- B24 - GRINDING POLISHING
Information Patent Application
Chemically modified chemical mechanical polishing pad, process of m...
- Publication number 20070037491
- Publication date Feb 15, 2007
- Yuzhuo Li
- B24 - GRINDING POLISHING
Information Patent Application
Photo-chemical remediation of Cu-CMP waste
- Publication number 20050072742
- Publication date Apr 7, 2005
- Yuzhuo Li
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chemical mechanical polishing composition and method
- Publication number 20040092102
- Publication date May 13, 2004
- Sachem, Inc.
- Yuzhou Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of fabricating a copper damascene structure
- Publication number 20030098434
- Publication date May 29, 2003
- Ferro Corporation
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Jason KELEHER

Person

Patents Grantslast 30 patents

Metal-passivating CMP compositions and methods

Copper-passivating CMP compositions and methods

Compositions and methods for CMP of low-k-dielectric materials

Photo-chemical remediation of Cu-CMP waste

Method of fabricating a copper damascene structure

Silica-based slurry

Slurry for chemical-mechanical polishing copper damascene structures

Diamond slurry for chemical-mechanical planarization of semiconduct...

Diamond slurry for chemical-mechanical planarization of semiconduct...

Patents Applicationslast 30 patents

DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANT

METAL-PASSIVATING CMP COMPOSITIONS AND METHODS

Copper-passivating CMP compositions and methods

Copper CMP composition containing ionic polyelectrolyte and method

DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANT

Compositions and methods for CMP of low-k-dielectric materials

CHEMICALLY MODIFIED CHEMICAL MECHANICAL POLISHING PAD

Chemically modified chemical mechanical polishing pad, process of m...

Photo-chemical remediation of Cu-CMP waste

Chemical mechanical polishing composition and method

Method of fabricating a copper damascene structure