Jason M. Gamba

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...
- Patent number 12,068,172
- Issue date Aug 20, 2024
- Intel Corporation
- Tarek A. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,817,390
- Issue date Nov 14, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge having a substrate with cond...
- Patent number 11,688,692
- Issue date Jun 27, 2023
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,640,942
- Issue date May 2, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filler material in conductive material that functions as...
- Patent number 11,527,484
- Issue date Dec 13, 2022
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,521,931
- Issue date Dec 6, 2022
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side de-bonding in component carriers using photoablation
- Patent number 11,462,432
- Issue date Oct 4, 2022
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,302,643
- Issue date Apr 12, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge having a molded region with...
- Patent number 11,233,009
- Issue date Jan 25, 2022
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filler material in conductive material that functions as...
- Patent number 10,847,471
- Issue date Nov 24, 2020
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...
- Publication number 20240355758
- Publication date Oct 24, 2024
- Intel Corporation
- Steven Adam Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
- Publication number 20240332155
- Publication date Oct 3, 2024
- Intel Corporation
- Jianyong Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED...
- Publication number 20240290723
- Publication date Aug 29, 2024
- Intel Corporation
- Jason Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20240030142
- Publication date Jan 25, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGING USING EMBEDDED-IN-MOLD (EIM) OPTICAL MODULE INTEG...
- Publication number 20230204879
- Publication date Jun 29, 2023
- Intel Corporation
- Dowon Kim
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER
- Publication number 20230197661
- Publication date Jun 22, 2023
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED OPTICAL PACKAGE
- Publication number 20230194778
- Publication date Jun 22, 2023
- Intel Corporation
- Dowon KIM
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20230197679
- Publication date Jun 22, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20230134770
- Publication date May 4, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM SURROUNDING A DIE ON A SUBSTRATE
- Publication number 20230086920
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE LINER FOR PROMOTION OF MOLD ADHESION IN INTEGRATED...
- Publication number 20230076148
- Publication date Mar 9, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CARRIER FOR ELECTRONIC SUBSTRATE TECHNOLOGIES
- Publication number 20230057384
- Publication date Feb 23, 2023
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20220181262
- Publication date Jun 9, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
- Publication number 20220155539
- Publication date May 19, 2022
- Intel Corporation
- Srinivas V. PIETAMBARAM
- G02 - OPTICS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...
- Publication number 20220093515
- Publication date Mar 24, 2022
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391264
- Publication date Dec 16, 2021
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391266
- Publication date Dec 16, 2021
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20210305162
- Publication date Sep 30, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...
- Publication number 20210305163
- Publication date Sep 30, 2021
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS...
- Publication number 20210043580
- Publication date Feb 11, 2021
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PADS TO PREVENT GALVANIC CORROSION OF FLI BUMPS IN EMIB...
- Publication number 20210035818
- Publication date Feb 4, 2021
- Intel Corporation
- Tarek A. IBRAHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POCKET STRUCTURES, MATERIALS, AND METHODS FOR INTEGRATED CIRCUIT PA...
- Publication number 20200066626
- Publication date Feb 27, 2020
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL FOR AN ELECTRONIC DEVICE
- Publication number 20200027841
- Publication date Jan 23, 2020
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DE-BONDING IN COMPONENT CARRIERS USING PHOTOABLATION
- Publication number 20190287841
- Publication date Sep 19, 2019
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Jason M. Gamba

Person

Patents Grantslast 30 patents

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...

Microelectronic component having molded regions with through-mold vias

Embedded multi-die interconnect bridge having a substrate with cond...

Microelectronic component having molded regions with through-mold vias

Dielectric filler material in conductive material that functions as...

Microelectronic structures including bridges

Dual side de-bonding in component carriers using photoablation

Microelectronic component having molded regions with through-mold vias

Embedded multi-die interconnect bridge having a molded region with...

Dielectric filler material in conductive material that functions as...

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...

SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS

PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED...

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

OPTICAL PACKAGING USING EMBEDDED-IN-MOLD (EIM) OPTICAL MODULE INTEG...

MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER

INTEGRATED OPTICAL PACKAGE

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

DAM SURROUNDING A DIE ON A SUBSTRATE

SILICON NITRIDE LINER FOR PROMOTION OF MOLD ADHESION IN INTEGRATED...

HYBRID CARRIER FOR ELECTRONIC SUBSTRATE TECHNOLOGIES

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...

DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS...

SACRIFICIAL PADS TO PREVENT GALVANIC CORROSION OF FLI BUMPS IN EMIB...

POCKET STRUCTURES, MATERIALS, AND METHODS FOR INTEGRATED CIRCUIT PA...

FIDUCIAL FOR AN ELECTRONIC DEVICE

DUAL SIDE DE-BONDING IN COMPONENT CARRIERS USING PHOTOABLATION