Jason Seungjoo Lee

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Position-controlled wave power generating apparatus
- Patent number 9,752,552
- Issue date Sep 5, 2017
- Postech Academy-Industry Foundation
- Son-Cheol Yu
- F05 - INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF...
Information Patent Grant
Semiconductor package having double layer leadframe
- Patent number 7,671,451
- Issue date Mar 2, 2010
- ChipPAC, Inc.
- Jason Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro chip-scale-package system
- Patent number 7,652,382
- Issue date Jan 26, 2010
- Stats Chippac Ltd.
- Jong Kook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro chip-scale-package system
- Patent number 7,298,052
- Issue date Nov 20, 2007
- Stats Chippac Ltd.
- Jong Kook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for peeling semiconductor chips from tape
- Patent number 7,238,258
- Issue date Jul 3, 2007
- Stats Chippac Ltd.
- Soo-San Park
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Position-Controlled Wave Power Generating Apparatus
- Publication number 20160003213
- Publication date Jan 7, 2016
- Son-Cheol Yu
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Application
SYSTEM FOR HANDLING SEMICONDUCTOR DIES
- Publication number 20090191029
- Publication date Jul 30, 2009
- Taeg Ki Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO CHIP-SCALE-PACKAGE SYSTEM
- Publication number 20080029861
- Publication date Feb 7, 2008
- Jong Kook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having double layer leadframe
- Publication number 20060192274
- Publication date Aug 31, 2006
- ChipPAC, Inc.
- Jason Lee
- H01 - BASIC ELECTRIC ELEMENTS