Jason SHEN

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with inner wafer carrier buffer and method
- Patent number 11,062,931
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jason Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach processes for semiconductor packages
- Patent number 10,685,853
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High throughput CMP platform
- Patent number 10,513,006
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor apparatus with inner wafer carrier buffer and method
- Patent number 10,403,532
- Issue date Sep 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jason Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and apparatus for fabrication of semiconductor p...
- Patent number 9,502,373
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and apparatus for fabrication of semiconductor p...
- Patent number 8,916,419
- Issue date Dec 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LID ATTACH PROCESS AND DISPENSER HEAD
- Publication number 20200286748
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Apparatus With Inner Wafer Carrier Buffer and Method
- Publication number 20190378736
- Publication date Dec 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jason Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH PROCESSES FOR SEMICONDUCTOR PACKAGES
- Publication number 20170076960
- Publication date Mar 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...
- Publication number 20150069089
- Publication date Mar 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT CMP PLATFORM
- Publication number 20140220863
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR APPARATUS WITH INNER WAFER CARRIER BUFFER AND METHOD
- Publication number 20140075774
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jason Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...
- Publication number 20130260511
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Lid attach process and dispenser head

Semiconductor apparatus with inner wafer carrier buffer and method

Lid attach processes for semiconductor packages

High throughput CMP platform

Semiconductor apparatus with inner wafer carrier buffer and method

Lid attach process and apparatus for fabrication of semiconductor p...

Lid attach process and apparatus for fabrication of semiconductor p...

Patents Applicationslast 30 patents

LID ATTACH PROCESS AND DISPENSER HEAD

Semiconductor Apparatus With Inner Wafer Carrier Buffer and Method

LID ATTACH PROCESSES FOR SEMICONDUCTOR PACKAGES

LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...

HIGH THROUGHPUT CMP PLATFORM

SEMICONDUCTOR APPARATUS WITH INNER WAFER CARRIER BUFFER AND METHOD

LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...