Jason Sweis

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Connection components with frangible leads and bus
- Patent number 6,888,229
- Issue date May 3, 2005
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection components with frangible leads and bus
- Patent number 6,054,756
- Issue date Apr 25, 2000
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making connections to a semiconductor chip assembly
- Patent number 5,915,752
- Issue date Jun 29, 1999
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interface between die and chip carrier
- Patent number 5,477,611
- Issue date Dec 26, 1995
- Tessera, Inc.
- Jason Sweis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shaped lead structure and method
- Patent number 5,398,863
- Issue date Mar 21, 1995
- Tessera, Inc.
- Gary W. Grube
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor inner lead bonding tool
- Patent number 5,390,844
- Issue date Feb 21, 1995
- Tessera, Inc.
- Thomas H. Distefano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Connection components with frangible leads and bus
- Publication number 20040238922
- Publication date Dec 2, 2004
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
P-connection components with frangible leads and bus
- Publication number 20020151111
- Publication date Oct 17, 2002
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS