Jason Thompson

Person

Melbourne, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 11,985,759
- Issue date May 14, 2024
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having flexible, heat conductive layer and associ...
- Patent number 11,665,856
- Issue date May 30, 2023
- Eagle Technology, LLC
- Jason Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 11,632,854
- Issue date Apr 18, 2023
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having heat transfer clamp and associated methods
- Patent number 11,503,701
- Issue date Nov 15, 2022
- Eagle Technology, LLC
- Jason Thompson
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Electronic device with cooling fluid manifold and multi-function co...
- Patent number 11,363,738
- Issue date Jun 14, 2022
- Eagle Technology, LLC
- Jason Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 11,076,478
- Issue date Jul 27, 2021
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for heatsink to rail thermal interface enhancement
- Patent number 10,791,652
- Issue date Sep 29, 2020
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 10,667,378
- Issue date May 26, 2020
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20240260169
- Publication date Aug 1, 2024
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20230239994
- Publication date Jul 27, 2023
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING FLEXIBLE, HEAT CONDUCTIVE LAYER AND ASSOCI...
- Publication number 20230128239
- Publication date Apr 27, 2023
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH COOLING FLUID MANIFOLD AND MULTI-FUNCTION CO...
- Publication number 20210410330
- Publication date Dec 30, 2021
- Eagle Technology, LLC
- Jason Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20210267046
- Publication date Aug 26, 2021
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20200245447
- Publication date Jul 30, 2020
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR HEATSINK TO RAIL THERMAL INTERFACE ENHANCEMENT
- Publication number 20190380225
- Publication date Dec 12, 2019
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jason Thompson

Person

Patents Grantslast 30 patents

Electronic assemblies having embedded passive heat pipes and associ...

Electronic device having flexible, heat conductive layer and associ...

Electronic assemblies having embedded passive heat pipes and associ...

Electronic device having heat transfer clamp and associated methods

Electronic device with cooling fluid manifold and multi-function co...

Electronic assemblies having embedded passive heat pipes and associ...

Systems and methods for heatsink to rail thermal interface enhancement

Electronic assemblies having embedded passive heat pipes and associ...

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

ELECTRONIC DEVICE HAVING FLEXIBLE, HEAT CONDUCTIVE LAYER AND ASSOCI...

ELECTRONIC DEVICE WITH COOLING FLUID MANIFOLD AND MULTI-FUNCTION CO...

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

SYSTEMS AND METHODS FOR HEATSINK TO RAIL THERMAL INTERFACE ENHANCEMENT