Jason Zhang

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local control of underfill flow on high density packages, packages...
- Patent number 7,359,211
- Issue date Apr 15, 2008
- Intel Corporation
- Juan Landeros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill material to reduce ball limiting metallurgy delamination...
- Patent number 7,218,007
- Issue date May 15, 2007
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Marking on underfill
- Patent number 7,015,592
- Issue date Mar 21, 2006
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local control of underfill flow on high density packages, packages...
- Publication number 20080150099
- Publication date Jun 26, 2008
- Juan Landeros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Underfill material to reduce ball limiting metallurgy delamination...
- Publication number 20060071337
- Publication date Apr 6, 2006
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Marking on underfill
- Publication number 20050206017
- Publication date Sep 22, 2005
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local control of underfill flow on high density packages, packages...
- Publication number 20050195582
- Publication date Sep 8, 2005
- Intel Corporation
- Juan Landeros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR