Jasper Kidger

Person

South Yorkshire, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,968,802
- Issue date Apr 23, 2024
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,653,472
- Issue date May 16, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,596,082
- Issue date Feb 28, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,470,739
- Issue date Oct 11, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,369,040
- Issue date Jun 21, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,096,313
- Issue date Aug 17, 2021
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR COOLING ELECTRONIC DEVICES IN AN ELECTRONIC MODULE
- Publication number 20240032243
- Publication date Jan 25, 2024
- ICEOTOPE GROUP LIMITED
- Jason MATTESON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20230240042
- Publication date Jul 27, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20230217629
- Publication date Jul 6, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING FOR IMMERSIVE LIQUID COOLING OF MULTIPLE ELECTRONIC DEVICES
- Publication number 20230083799
- Publication date Mar 16, 2023
- ICEOTOPE GROUP LIMITED
- Andrew SHAW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20220418153
- Publication date Dec 29, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20220256734
- Publication date Aug 11, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20210321534
- Publication date Oct 14, 2021
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20210321535
- Publication date Oct 14, 2021
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20200305307
- Publication date Sep 24, 2020
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS

Jasper Kidger

Person

Patents Grantslast 30 patents

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Patents Applicationslast 30 patents

SYSTEM FOR COOLING ELECTRONIC DEVICES IN AN ELECTRONIC MODULE

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HOUSING FOR IMMERSIVE LIQUID COOLING OF MULTIPLE ELECTRONIC DEVICES

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...