Jatinder KUMAR

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Jalandhar City, IN

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Patents Grantslast 30 patents

Information Patent Grant
Conductive chip disposed on lead semiconductor package
- Patent number 8,525,321
- Issue date Sep 3, 2013
- Fairchild Semiconductor Corporation
- Jatinder Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a packaging substrate having a trench
- Patent number 8,519,521
- Issue date Aug 27, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including removing a conduc...
- Patent number 8,268,676
- Issue date Sep 18, 2012
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component with a low cost l...
- Patent number 7,939,380
- Issue date May 10, 2011
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacture
- Patent number 7,402,895
- Issue date Jul 22, 2008
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS...
- Publication number 20130307134
- Publication date Nov 21, 2013
- Fairchild Semiconductor Corporation
- Jatinder KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS...
- Publication number 20130009309
- Publication date Jan 10, 2013
- Jatinder Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH
- Publication number 20120306066
- Publication date Dec 6, 2012
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH
- Publication number 20110115061
- Publication date May 19, 2011
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
- Publication number 20090102028
- Publication date Apr 23, 2009
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure and method of manufacture
- Publication number 20070138610
- Publication date Jun 21, 2007
- Semiconductor Components Industries, LLC.
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS