Javed HUSSAIN

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Mechanical packaging technique of attaching MEMS and flex circuit
- Patent number 8,806,925
- Issue date Aug 19, 2014
- S3C, Inc.
- Ihioma U. Nzeadibe
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR MINIMIZING DEFLECTION OF A MEMBRANCE OF AN AB...
- Publication number 20130214370
- Publication date Aug 22, 2013
- S3C, Inc.
- Javed Hussain
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
- Publication number 20130130424
- Publication date May 23, 2013
- S3C, Inc.
- Roger Horton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT
- Publication number 20130125634
- Publication date May 23, 2013
- S3C, Inc.
- Ihioma U. NZEADIBE
- G01 - MEASURING TESTING