Javier A. FALCON

Person

Chandler, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging with high density interconnects
- Patent number 11,881,457
- Issue date Jan 23, 2024
- Tahoe Research, LTD.
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with high frequency communication modules h...
- Patent number 11,387,200
- Issue date Jul 12, 2022
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with compound semiconductor device...
- Patent number 11,335,651
- Issue date May 17, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV-less die stacking using plated pillars/through mold interconnect
- Patent number 11,296,052
- Issue date Apr 5, 2022
- Intel Corporation
- Preston T. Meyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum circuit assemblies with on-chip demultiplexers
- Patent number 11,177,912
- Issue date Nov 16, 2021
- Intel Corporation
- Adel A. Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packaging with high density interconnects
- Patent number 10,971,453
- Issue date Apr 6, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum computing assemblies with through-hole dies
- Patent number 10,756,004
- Issue date Aug 25, 2020
- Intel Corporation
- Adel A. Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 10,707,171
- Issue date Jul 7, 2020
- Intel Corporation
- Tomita Yoshihiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with high frequency communication modules h...
- Patent number 10,629,551
- Issue date Apr 21, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with high frequency communication...
- Patent number 10,573,608
- Issue date Feb 25, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with top superconductor layers for qubit devices
- Patent number 10,468,578
- Issue date Nov 5, 2019
- Intel Corporation
- Adel A. Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum computing assemblies
- Patent number 10,380,496
- Issue date Aug 13, 2019
- Intel Corporation
- Adel A. Elsherbini
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Shielded interconnects
- Patent number 10,319,896
- Issue date Jun 11, 2019
- Intel Corporation
- Javier A. Falcon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Qubit die attachment using preforms
- Patent number 10,256,206
- Issue date Apr 9, 2019
- Intel Corporation
- Javier A. Falcon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space-efficient underfilling techniques for electronic assemblies
- Patent number 9,728,425
- Issue date Aug 8, 2017
- Intel Corporation
- Joshua D. Heppner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20220344273
- Publication date Oct 27, 2022
- Intel Corporation
- Toshihiro TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20220246554
- Publication date Aug 4, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199449
- Publication date Jun 23, 2022
- Intel Corporation
- Michael J. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS
- Publication number 20210193583
- Publication date Jun 24, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20200286834
- Publication date Sep 10, 2020
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...
- Publication number 20200227366
- Publication date Jul 16, 2020
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-LESS DIE STACKING USING PLATED PILLARS/THROUGH MOLD INTERCONNECT
- Publication number 20200212012
- Publication date Jul 2, 2020
- Intel Corporation
- Preston T. MEYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS
- Publication number 20190259705
- Publication date Aug 22, 2019
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM CIRCUIT ASSEMBLIES WITH ON-CHIP DEMULTIPLEXERS
- Publication number 20190044668
- Publication date Feb 7, 2019
- Intel Corporation
- Adel A. Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM COMPUTING ASSEMBLIES
- Publication number 20190042964
- Publication date Feb 7, 2019
- Intel Corporation
- Adel A. Elsherbini
- B82 - NANO-TECHNOLOGY
Information Patent Application
PACKAGE SUBSTRATES WITH TOP SUPERCONDUCTOR LAYERS FOR QUBIT DEVICES
- Publication number 20190044047
- Publication date Feb 7, 2019
- Intel Corporation
- Adel A. Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUBIT DIE ATTACHMENT USING PREFORMS
- Publication number 20190043822
- Publication date Feb 7, 2019
- Intel Corporation
- Javier A. Falcon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED INTERCONNECTS
- Publication number 20190006572
- Publication date Jan 3, 2019
- Intel Corporation
- Javier A. Falcon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...
- Publication number 20180342472
- Publication date Nov 29, 2018
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20180337135
- Publication date Nov 22, 2018
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...
- Publication number 20180331051
- Publication date Nov 15, 2018
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20180240762
- Publication date Aug 23, 2018
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES
- Publication number 20180061673
- Publication date Mar 1, 2018
- Intel Corporation
- JOSHUA D. HEPPNER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS
- Publication number 20170179080
- Publication date Jun 22, 2017
- Intel Corporation
- Akshay MATHKAR
- H01 - BASIC ELECTRIC ELEMENTS

Javier A. FALCON

Person

Patents Grantslast 30 patents

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor packaging with high density interconnects

Microelectronic devices with high frequency communication modules h...

Microelectronic devices designed with compound semiconductor device...

TSV-less die stacking using plated pillars/through mold interconnect

Quantum circuit assemblies with on-chip demultiplexers

Semiconductor packaging with high density interconnects

Quantum computing assemblies with through-hole dies

Ultra small molded module integrated with die by module-on-wafer as...

Microelectronic devices with high frequency communication modules h...

Microelectronic devices designed with high frequency communication...

Package substrates with top superconductor layers for qubit devices

Quantum computing assemblies

Shielded interconnects

Qubit die attachment using preforms

Space-efficient underfilling techniques for electronic assemblies

Patents Applicationslast 30 patents

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...

TSV-LESS DIE STACKING USING PLATED PILLARS/THROUGH MOLD INTERCONNECT

SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS

QUANTUM CIRCUIT ASSEMBLIES WITH ON-CHIP DEMULTIPLEXERS

QUANTUM COMPUTING ASSEMBLIES

PACKAGE SUBSTRATES WITH TOP SUPERCONDUCTOR LAYERS FOR QUBIT DEVICES

QUBIT DIE ATTACHMENT USING PREFORMS

SHIELDED INTERCONNECTS

MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS