Javier Soto

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines having l-shaped cros...
- Patent number 11,329,358
- Issue date May 10, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device including a transmission line associated with one o...
- Patent number 10,651,525
- Issue date May 12, 2020
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographacally defined vias for organic package substrate scaling
- Patent number 10,381,291
- Issue date Aug 13, 2019
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines using shaped vias
- Patent number 9,992,859
- Issue date Jun 5, 2018
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes of making pad-less interconnect for electrical coreless s...
- Patent number 9,049,807
- Issue date Jun 2, 2015
- Intel Corporation
- Javier Soto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20220231394
- Publication date Jul 21, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20200235449
- Publication date Jul 23, 2020
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHACALLY DEFINED VIAS FOR ORGANIC PACKAGE SUBSTRATE SCALING
- Publication number 20180233431
- Publication date Aug 16, 2018
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Loss and Low Cross Talk Transmission Lines using Shaped Vias
- Publication number 20170093007
- Publication date Mar 30, 2017
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PACKAGE TO PACKAGE CONNECTION
- Publication number 20090321906
- Publication date Dec 31, 2009
- Nicholas Randolph Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct layer laser lamination for electrical bump substrates, and p...
- Publication number 20090314519
- Publication date Dec 24, 2009
- Javier Soto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR