Jaw-Shiun Hsieh

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Laser method for forming vias
- Patent number 6,429,049
- Issue date Aug 6, 2002
- Advanced Semiconductor Engineering, Inc.
- Chun-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a ball bump for wire bonding and the formation thereof
- Patent number 6,244,499
- Issue date Jun 12, 2001
- Advanced Semiconductor Engineering, Inc.
- Yu-Fang Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Cavity down ball grid array packaging structure
- Publication number 20020195721
- Publication date Dec 26, 2002
- Chun-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a ball bump for wire bonding and the formation thereof
- Publication number 20010022315
- Publication date Sep 20, 2001
- Advanced Semiconductor Engineering, Inc.
- Yu-Fang Tsai
- H01 - BASIC ELECTRIC ELEMENTS