Jawahar P. Nayak

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Building metal pillars in a chip for structure support
- Patent number 7,456,098
- Issue date Nov 25, 2008
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via barrier layers continuous with metal line barrier layers at not...
- Patent number 7,138,714
- Issue date Nov 21, 2006
- International Business Machines Corporation
- Du B. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Building metal pillars in a chip for structure support
- Patent number 7,067,902
- Issue date Jun 27, 2006
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via-stud with improved reliability in copper metallurgy
- Patent number 6,972,209
- Issue date Dec 6, 2005
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Halo-free non-rectifying contact on chip with halo source/drain dif...
- Patent number 6,750,109
- Issue date Jun 15, 2004
- International Business Machines Corporation
- James A. Culp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for screening features on an electronic substrate with a lo...
- Patent number 6,475,555
- Issue date Nov 5, 2002
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Halo-free non-rectifying contact on chip with halo source/drain dif...
- Patent number 6,429,482
- Issue date Aug 6, 2002
- International Business Machines Corporation
- James A. Culp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-patterned substrate layers for being personalized as needed
- Patent number 6,341,417
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single mask screening process
- Patent number 6,238,741
- Issue date May 29, 2001
- International Business Machines Corporation
- James M. Blazick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a multilayer ceramic substrate with max-punched vias
- Patent number 6,231,707
- Issue date May 15, 2001
- International Business Machines Corporation
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect reduction method for screened greensheets and article produc...
- Patent number 6,221,193
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Richard J. Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for large greensheet screening including high thix...
- Patent number 5,951,917
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Jawahar P. Nayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for large greensheet screening including high thix...
- Patent number 5,783,113
- Issue date Jul 21, 1998
- International Business Machines Corporation
- Jawahar P. Nayak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Building metal pillars in a chip for structure support
- Publication number 20060190846
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY AND FUNCTIONALITY IMPROVEMENTS ON COPPER INTERCONNECTS...
- Publication number 20060180930
- Publication date Aug 17, 2006
- International Business Machines Corporation
- Du B. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20060014376
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Building metal pillars in a chip for structure support
- Publication number 20050118803
- Publication date Jun 2, 2005
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20040101663
- Publication date May 27, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Halo-free non-rectifying contact on chip with halo source/drain dif...
- Publication number 20020149058
- Publication date Oct 17, 2002
- International Business Machines Corporation
- James A. Culp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-patterned substrate layers for being personalized as needed
- Publication number 20020023779
- Publication date Feb 28, 2002
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR SCREENING FEATURES ON AN ELECTRONIC SUBSTRATE WITH A LO...
- Publication number 20020009539
- Publication date Jan 24, 2002
- JON A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single mask screening process and structure produced thereby
- Publication number 20010006116
- Publication date Jul 5, 2001
- International Business Machines Corporation
- James M. Blazick
- H01 - BASIC ELECTRIC ELEMENTS

Jawahar P. Nayak

Person

Patents Grantslast 30 patents

Building metal pillars in a chip for structure support

Via barrier layers continuous with metal line barrier layers at not...

Building metal pillars in a chip for structure support

Stacked via-stud with improved reliability in copper metallurgy

Halo-free non-rectifying contact on chip with halo source/drain dif...

Process for screening features on an electronic substrate with a lo...

Halo-free non-rectifying contact on chip with halo source/drain dif...

Pre-patterned substrate layers for being personalized as needed

Single mask screening process

Method of forming a multilayer ceramic substrate with max-punched vias

Defect reduction method for screened greensheets and article produc...

Conductive paste for large greensheet screening including high thix...

Conductive paste for large greensheet screening including high thix...

Patents Applicationslast 30 patents

Building metal pillars in a chip for structure support

RELIABILITY AND FUNCTIONALITY IMPROVEMENTS ON COPPER INTERCONNECTS...

Stacked via-stud with improved reliability in copper metallurgy

Building metal pillars in a chip for structure support

Stacked via-stud with improved reliability in copper metallurgy

Halo-free non-rectifying contact on chip with halo source/drain dif...

Pre-patterned substrate layers for being personalized as needed

PROCESS FOR SCREENING FEATURES ON AN ELECTRONIC SUBSTRATE WITH A LO...

Single mask screening process and structure produced thereby