Jay A. Bunt

Person

Esopus, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coolant-cooled heat sink(s) with associated ultra-violet light asse...
- Patent number 12,005,148
- Issue date Jun 11, 2024
- International Business Machines Corporation
- Hongqing Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
High power device fault localization via die surface contouring
- Patent number 11,940,271
- Issue date Mar 26, 2024
- International Business Machines Corporation
- David J. Lewison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-respondent assemblies with porous heat transfer element(s)
- Patent number 11,716,808
- Issue date Aug 1, 2023
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Non-destructive bond line thickness measurement of thermal interfac...
- Patent number 11,614,324
- Issue date Mar 28, 2023
- International Business Machines Corporation
- Hongqing Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid/heat spreader having targeted flexibility
- Patent number 11,430,710
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-respondent assembly with structural material within sealed i...
- Patent number 11,191,155
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Hongqing Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal integrated circuit (IC) device package lid
- Patent number 11,158,562
- Issue date Oct 26, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Coolant-cooled heat sinks with internal thermally-conductive fins j...
- Patent number 11,156,409
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fabricating coolant-cooled heat sinks with internal thermally-condu...
- Patent number 10,842,043
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus for providing uniaxial load distribution for laminate lay...
- Patent number 8,156,990
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for providing uniaxial load distribution for laminate layers...
- Patent number 7,947,143
- Issue date May 24, 2011
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for providing uniaxial load distribution for laminate lay...
- Patent number 7,836,935
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
FILTER DEVICE HAVING MULTIPLE CHANGEABLE FILTER SURFACES
- Publication number 20230381705
- Publication date Nov 30, 2023
- International Business Machines Corporation
- Madhana Sunder
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...
- Publication number 20220347327
- Publication date Nov 3, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)
- Publication number 20220192011
- Publication date Jun 16, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HIGH POWER DEVICE FAULT LOCALIZATION VIA DIE SURFACE CONTOURING
- Publication number 20220155049
- Publication date May 19, 2022
- International Business Machines Corporation
- David J. Lewison
- G01 - MEASURING TESTING
Information Patent Application
Conformal Integrated Circuit (IC) Device Package Lid
- Publication number 20210249333
- Publication date Aug 12, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY
- Publication number 20210233825
- Publication date Jul 29, 2021
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...
- Publication number 20210222956
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFAC...
- Publication number 20210123729
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Hongqing Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS...
- Publication number 20080190545
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...
- Publication number 20080190565
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...
- Publication number 20080190566
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR L...
- Publication number 20070113950
- Publication date May 24, 2007
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS

Jay A. Bunt

Person

Patents Grantslast 30 patents

Coolant-cooled heat sink(s) with associated ultra-violet light asse...

High power device fault localization via die surface contouring

Tamper-respondent assemblies with porous heat transfer element(s)

Non-destructive bond line thickness measurement of thermal interfac...

Lid/heat spreader having targeted flexibility

Tamper-respondent assembly with structural material within sealed i...

Conformal integrated circuit (IC) device package lid

Coolant-cooled heat sinks with internal thermally-conductive fins j...

Fabricating coolant-cooled heat sinks with internal thermally-condu...

Apparatus for providing uniaxial load distribution for laminate lay...

Method for providing uniaxial load distribution for laminate layers...

Apparatus for providing uniaxial load distribution for laminate lay...

Patents Applicationslast 30 patents

FILTER DEVICE HAVING MULTIPLE CHANGEABLE FILTER SURFACES

COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...

TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)

HIGH POWER DEVICE FAULT LOCALIZATION VIA DIE SURFACE CONTOURING

Conformal Integrated Circuit (IC) Device Package Lid

LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY

COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...

NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFAC...

METHOD FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS...

APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...

APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...

METHOD AND APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR L...