Jay CHAO

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Irvine, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE U...
- Publication number 20240301129
- Publication date Sep 12, 2024
- Henkel AG & Co. KGaA
- Chunlin He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS
- Publication number 20210163674
- Publication date Jun 3, 2021
- Henkel IP & Holding GmbH
- Jay CHAO
- H01 - BASIC ELECTRIC ELEMENTS