Jay Goff

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Warwick, RI, US

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Patents Grantslast 30 patents

Information Patent Grant
High density grid array test socket
- Patent number 5,290,193
- Issue date Mar 1, 1994
- Augat Inc.
- Jay Goff
- G01 - MEASURING TESTING
Information Patent Grant
High density grid array test socket
- Patent number 5,205,742
- Issue date Apr 27, 1993
- Augat Inc.
- Jay Goff
- G01 - MEASURING TESTING
Information Patent Grant
Flex dot wafer probe
- Patent number 4,899,099
- Issue date Feb 6, 1990
- Augat Inc.
- David W. Mendenhall
- G01 - MEASURING TESTING
Information Patent Grant
High density backplane connector
- Patent number 4,881,901
- Issue date Nov 21, 1989
- Augat Inc.
- David W. Mendenhall
- H01 - BASIC ELECTRIC ELEMENTS