Jay J. Liu

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip bonded to a substrate and method of making
- Patent number 5,385,869
- Issue date Jan 31, 1995
- Motorola, Inc.
- Jay J. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for solder removal
- Patent number 5,072,873
- Issue date Dec 17, 1991
- Motorola, Inc.
- Jay J. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR