Jay S. Greenspan

Person

South Dartmouth, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low resistance hermetic lead structure
- Patent number 6,476,464
- Issue date Nov 5, 2002
- Ixion, LLC
- Jay Greenspan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 6,078,501
- Issue date Jun 20, 2000
- Omnirel LLC
- John Catrambone
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Surface mount device with high thermal conductivity
- Patent number 5,188,985
- Issue date Feb 23, 1993
- Aegis, Inc.
- Manuel Medeiros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount device with high thermal conductivity
- Patent number 5,111,277
- Issue date May 5, 1992
- Aegis, Inc.
- Manuel Medeiros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic glass chip carrier
- Patent number 4,855,808
- Issue date Aug 8, 1989
- Steven A. Tower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing package height for microcircuit p...
- Patent number 4,547,624
- Issue date Oct 15, 1985
- Isotronics, Inc.
- Steven A. Tower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave chip carrier
- Patent number 4,487,999
- Issue date Dec 11, 1984
- Isotronics, Inc.
- Phillips C. Baird
- G02 - OPTICS
Information Patent Grant
Lead grounding
- Patent number 4,453,033
- Issue date Jun 5, 1984
- Isotronics, Inc.
- Raymond J. Duff
- H01 - BASIC ELECTRIC ELEMENTS

Jay S. Greenspan

Person

Patents Grantslast 30 patents

Low resistance hermetic lead structure

Power semiconductor module

Surface mount device with high thermal conductivity

Surface mount device with high thermal conductivity

Hermetic glass chip carrier

Method and apparatus for reducing package height for microcircuit p...

Microwave chip carrier

Lead grounding