Jay Scott Salmon

Person

Pittsburgh, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded lead frame package with embedded die
- Patent number 10,160,637
- Issue date Dec 25, 2018
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame-based chip carrier used in the fabrication of MEMS trans...
- Patent number 10,057,688
- Issue date Aug 21, 2018
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metalized microphone lid with integrated wire bonding shelf
- Patent number 10,028,068
- Issue date Jul 17, 2018
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package with molded spacer
- Patent number 9,894,444
- Issue date Feb 13, 2018
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package with molded spacer
- Patent number 9,661,421
- Issue date May 23, 2017
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metalized microphone lid with integrated wire bonding shelf
- Patent number 9,641,940
- Issue date May 2, 2017
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package with integrated substrate
- Patent number 9,319,799
- Issue date Apr 19, 2016
- Robert Bosch GmbH
- Jay Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity package design
- Patent number 9,238,579
- Issue date Jan 19, 2016
- Robert Bosch GmbH
- Eric Ochs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone package with molded interconnect device
- Patent number 9,002,038
- Issue date Apr 7, 2015
- Robert Bosch GmbH
- Eric Ochs
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PROBE HEAD ASSEMBLIES AND PROBE SYSTEMS FOR TESTING INTEGRATED CIRC...
- Publication number 20170363681
- Publication date Dec 21, 2017
- Cascade Microtech, Inc.
- JAY SALMON
- G01 - MEASURING TESTING
Information Patent Application
SPACE TRANSFORMERS, PLANARIZATION LAYERS FOR SPACE TRANSFORMERS, ME...
- Publication number 20170330677
- Publication date Nov 16, 2017
- Cascade Microtech, Inc.
- Jay Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPHONE PACKAGE WITH MOLDED SPACER
- Publication number 20170303049
- Publication date Oct 19, 2017
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METALIZED MICROPHONE LID WITH INTEGRATED WIRE BONDING SHELF
- Publication number 20170195814
- Publication date Jul 6, 2017
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS CHIP SCALE PACKAGE
- Publication number 20170113926
- Publication date Apr 27, 2017
- ROBERT BOSCH GmbH
- Eric Ochs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Microphone Package
- Publication number 20170048625
- Publication date Feb 16, 2017
- ROBERT BOSCH GmbH
- Jay S. Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METALIZED MICROPHONE LID WITH INTEGRATD WIRE BONDING SHELF
- Publication number 20160212548
- Publication date Jul 21, 2016
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOLDED LEAD FRAME PACKAGE WITH EMBEDDED DIE
- Publication number 20160207759
- Publication date Jul 21, 2016
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY PACKAGE DESIGN
- Publication number 20160137490
- Publication date May 19, 2016
- ROBERT BOSCH GmbH
- Eric Ochs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEAD FRAME-BASED CHIP CARRIER USED IN THE FABRICATION OF MEMS TRANS...
- Publication number 20160134974
- Publication date May 12, 2016
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE WITH MOLDED SPACER
- Publication number 20160127838
- Publication date May 5, 2016
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE PACKAGE WITH INTEGRATED SUBSTRATE
- Publication number 20140264654
- Publication date Sep 18, 2014
- ROBERT BOSCH GmbH
- Jay Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE WITH MOLDED INTERCONNECT DEVICE
- Publication number 20140072151
- Publication date Mar 13, 2014
- ROBERT BOSCH GmbH
- Eric Ochs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY PACKAGE DESIGN
- Publication number 20130256815
- Publication date Oct 3, 2013
- ROBERT BOSCH GmbH
- Eric Ochs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CHIP SCALE PACKAGE
- Publication number 20130147040
- Publication date Jun 13, 2013
- ROBERT BOSCH GmbH
- Eric Ochs
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jay Scott Salmon

Person

Patents Grantslast 30 patents

Molded lead frame package with embedded die

Lead frame-based chip carrier used in the fabrication of MEMS trans...

Metalized microphone lid with integrated wire bonding shelf

Microphone package with molded spacer

Microphone package with molded spacer

Metalized microphone lid with integrated wire bonding shelf

Microphone package with integrated substrate

Cavity package design

MEMS microphone package with molded interconnect device

Patents Applicationslast 30 patents

PROBE HEAD ASSEMBLIES AND PROBE SYSTEMS FOR TESTING INTEGRATED CIRC...

SPACE TRANSFORMERS, PLANARIZATION LAYERS FOR SPACE TRANSFORMERS, ME...

MICROPHONE PACKAGE WITH MOLDED SPACER

METALIZED MICROPHONE LID WITH INTEGRATED WIRE BONDING SHELF

MEMS CHIP SCALE PACKAGE

MEMS Microphone Package

METALIZED MICROPHONE LID WITH INTEGRATD WIRE BONDING SHELF

MOLDED LEAD FRAME PACKAGE WITH EMBEDDED DIE

CAVITY PACKAGE DESIGN

LEAD FRAME-BASED CHIP CARRIER USED IN THE FABRICATION OF MEMS TRANS...

MICROPHONE PACKAGE WITH MOLDED SPACER

MICROPHONE PACKAGE WITH INTEGRATED SUBSTRATE

MEMS MICROPHONE PACKAGE WITH MOLDED INTERCONNECT DEVICE

CAVITY PACKAGE DESIGN

MEMS CHIP SCALE PACKAGE