Jay Scott Salmon

Follow

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising an integrated device with a back side metal layer
- Patent number 12,100,649
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
- Patent number 12,100,669
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a block device with a shield and method of fabri...
- Patent number 11,985,804
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-component modules (MCMs) including configurable electro-magne...
- Patent number 11,721,639
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA MODULE HAVING ANTENNA IN MOLD LAYER, AND RELATED FABRICATIO...
- Publication number 20240396227
- Publication date Nov 28, 2024
- QUALCOMM Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...
- Publication number 20240021538
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE WITH A BACK SIDE METAL LAYER
- Publication number 20230091182
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Chien-Te FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A PAD INTERCONNECT COMPRISING A...
- Publication number 20230070275
- Publication date Mar 9, 2023
- QUALCOMM Incorporated
- Anirudh BHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD
- Publication number 20230023868
- Publication date Jan 26, 2023
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTRO-MAGNE...
- Publication number 20210407927
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS