Jayaganasan Narayanasamy

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package lead design with grooves for improved dambar separation
- Patent number 11,362,023
- Issue date Jun 14, 2022
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Selective plating of semiconductor package leads
- Patent number 10,651,109
- Issue date May 12, 2020
- Infineon Technologies AG
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a matrix composite layer and workpiece with a ma...
- Patent number 10,457,001
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing a semiconductor co...
- Patent number 10,121,723
- Issue date Nov 6, 2018
- Infineon Technologies Austria AG
- Kok Tee Lau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package with Vertical Electronic Components Held Together by a Clip
- Publication number 20250062273
- Publication date Feb 20, 2025
- Infineon Technologies Austria AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FUNCTIONAL THERMAL PERFORMANCE SEMICONDUCTOR PACKAGE AND RELAT...
- Publication number 20230154827
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A POWER SEMI...
- Publication number 20220115245
- Publication date Apr 14, 2022
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE
- Publication number 20220102263
- Publication date Mar 31, 2022
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Package Lead Design with Grooves for Improved Dambar Separation
- Publication number 20210013135
- Publication date Jan 14, 2021
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Plating of Semiconductor Package Leads
- Publication number 20200020607
- Publication date Jan 16, 2020
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Plating of Semiconductor Package Leads
- Publication number 20200020621
- Publication date Jan 16, 2020
- Syahir Abd Hamid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Forming a Matrix Composite Layer and Workpiece With a Ma...
- Publication number 20180297301
- Publication date Oct 18, 2018
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...
- Publication number 20180301390
- Publication date Oct 18, 2018
- Infineon Technologies Austria AG
- Kok Tee Lau
- H01 - BASIC ELECTRIC ELEMENTS

Jayaganasan Narayanasamy

Person

Patents Grantslast 30 patents

Semiconductor package having a chip carrier with a pad offset feature

Power semiconductor device with dual heat dissipation structures

Package lead design with grooves for improved dambar separation

Pressure sensor having a lidless/laminate structure

Selective plating of semiconductor package leads

Method for forming a matrix composite layer and workpiece with a ma...

Semiconductor component and method for producing a semiconductor co...

Patents Applicationslast 30 patents

Package with Vertical Electronic Components Held Together by a Clip

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

DUAL FUNCTIONAL THERMAL PERFORMANCE SEMICONDUCTOR PACKAGE AND RELAT...

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A POWER SEMI...

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE

Pressure Sensor

Package Lead Design with Grooves for Improved Dambar Separation

Selective Plating of Semiconductor Package Leads

Selective Plating of Semiconductor Package Leads

Method for Forming a Matrix Composite Layer and Workpiece With a Ma...

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...