Jaydeep K. Sinha

Person

E Norwood, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process-induced distortion prediction and feedforward and feedback...
- Patent number 11,761,880
- Issue date Sep 19, 2023
- KLA Corporation
- Pradeep Vukkadala
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Prediction based chucking and lithography control optimization
- Patent number 10,788,759
- Issue date Sep 29, 2020
- KLA-Tencor Corporation
- Bin-Ming Benjamin Tsai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Patterned wafer geometry measurements for semiconductor process con...
- Patent number 10,576,603
- Issue date Mar 3, 2020
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process-induced distortion prediction and feedforward and feedback...
- Patent number 10,401,279
- Issue date Sep 3, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems, methods and metrics for wafer high order shape characteriz...
- Patent number 10,379,061
- Issue date Aug 13, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for wafer structure uniformity monitoring using...
- Patent number 10,352,691
- Issue date Jul 16, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for wafer surface feature detection, classifica...
- Patent number 10,330,608
- Issue date Jun 25, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overlay and semiconductor process control using a wafer geometry me...
- Patent number 10,249,523
- Issue date Apr 2, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Grant
Prediction based chucking and lithography control optimization
- Patent number 10,036,964
- Issue date Jul 31, 2018
- KLA-Tencor Corporation
- Bin-Ming Benjamin Tsai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
System and method to emulate finite element model based prediction...
- Patent number 10,025,894
- Issue date Jul 17, 2018
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for effective pattern wafer surface measurement...
- Patent number 9,865,047
- Issue date Jan 9, 2018
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process-induced asymmetry detection, quantification, and control us...
- Patent number 9,779,202
- Issue date Oct 3, 2017
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Predictive wafer modeling based focus error prediction using correl...
- Patent number 9,707,660
- Issue date Jul 18, 2017
- KLA-Tencor Corporation
- Pradeep Vukkadala
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods for wafer surface feature detection and quantif...
- Patent number 9,702,829
- Issue date Jul 11, 2017
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Detection of selected defects in relatively noisy inspection data
- Patent number 9,646,379
- Issue date May 9, 2017
- KLA-Tencor Corp.
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid phase unwrapping systems and methods for patterned wafer mea...
- Patent number 9,632,038
- Issue date Apr 25, 2017
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and device for using substrate geometry to determine optimum...
- Patent number 9,588,441
- Issue date Mar 7, 2017
- KLA-Tencor Corporation
- Craig W. MacNaughton
- G05 - CONTROLLING REGULATING
Information Patent Grant
Predicting and controlling critical dimension issues and pattern de...
- Patent number 9,558,545
- Issue date Jan 31, 2017
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems, methods and metrics for wafer high order shape characteriz...
- Patent number 9,546,862
- Issue date Jan 17, 2017
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Using wafer geometry to improve scanner correction effectiveness fo...
- Patent number 9,513,565
- Issue date Dec 6, 2016
- KLA-Tencor Corporation
- Craig MacNaughton
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
System and method to emulate finite element model based prediction...
- Patent number 9,430,593
- Issue date Aug 30, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enhanced patterned wafer geometry measurements based design improve...
- Patent number 9,373,165
- Issue date Jun 21, 2016
- KLA-Tencor Corporation
- Amir Azordegan
- G01 - MEASURING TESTING
Information Patent Grant
Detection of selected defects in relatively noisy inspection data
- Patent number 9,355,440
- Issue date May 31, 2016
- KLA-Tencor Corp.
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods of advanced site-based nanotopography for wafer...
- Patent number 9,177,370
- Issue date Nov 3, 2015
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Statistical overlay error prediction for feed forward and feedback...
- Patent number 9,087,176
- Issue date Jul 21, 2015
- KLA-Tencor Corporation
- Wei Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bright-field differential interference contrast system with scannin...
- Patent number 9,052,190
- Issue date Jun 9, 2015
- KLA-Tencor Corporation
- Ali Salehpour
- G01 - MEASURING TESTING
Information Patent Grant
Using wafer geometry to improve scanner correction effectiveness fo...
- Patent number 9,029,810
- Issue date May 12, 2015
- KLA-Tencor Corporation
- Craig MacNaughton
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods and systems of object based metrology for advanced wafer su...
- Patent number 9,031,810
- Issue date May 12, 2015
- Haiguang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Site based quantification of substrate topography and its relation...
- Patent number 8,768,665
- Issue date Jul 1, 2014
- KLA-Tencor Technologies Corporation
- Sathish Veeraraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for improved localized feature quantification i...
- Patent number 8,630,479
- Issue date Jan 14, 2014
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Process-Induced Distortion Prediction and Feedforward and Feedback...
- Publication number 20190353582
- Publication date Nov 21, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZ...
- Publication number 20190271654
- Publication date Sep 5, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
Prediction Based Chucking and Lithography Control Optimization
- Publication number 20180364579
- Publication date Dec 20, 2018
- KLA-Tencor Corporation
- Bin-Ming Benjamin Tsai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Overlay and Semiconductor Process Control Using a Wafer Geometry Me...
- Publication number 20160372353
- Publication date Dec 22, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
Process-Induced Asymmetry Detection, Quantification, and Control Us...
- Publication number 20160371423
- Publication date Dec 22, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Hybrid Phase Unwrapping Systems and Methods for Patterned Wafer Mea...
- Publication number 20160321799
- Publication date Nov 3, 2016
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
System and Method to Emulate Finite Element Model Based Prediction...
- Publication number 20160283625
- Publication date Sep 29, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Prediction Based Chucking and Lithography Control Optimization
- Publication number 20160239600
- Publication date Aug 18, 2016
- KLA-Tencor Corporation
- Bin-Ming Benjamin Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Predicting and Controlling Critical Dimension Issues and Pattern De...
- Publication number 20160163033
- Publication date Jun 9, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Enhanced Patterned Wafer Geometry Measurements Based Design Improve...
- Publication number 20160071260
- Publication date Mar 10, 2016
- KLA-Tencor Corporation
- Amir Azordegan
- G01 - MEASURING TESTING
Information Patent Application
Predictive Modeling Based Focus Error Prediction
- Publication number 20150302312
- Publication date Oct 22, 2015
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
Patterned Wafer Geometry Measurements for Semiconductor Process Con...
- Publication number 20150298282
- Publication date Oct 22, 2015
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...
- Publication number 20150212429
- Publication date Jul 30, 2015
- KLA-Tencor Corporation
- Craig MacNaughton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process-Induced Distortion Prediction and Feedforward and Feedback...
- Publication number 20150120216
- Publication date Apr 30, 2015
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...
- Publication number 20140353527
- Publication date Dec 4, 2014
- KLA-Tencor Corporation
- Craig MacNaughton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Inspection and Metrology Techniques And Systems Using Brig...
- Publication number 20140268172
- Publication date Sep 18, 2014
- Ali Salehpour
- G01 - MEASURING TESTING
Information Patent Application
Systems, Methods and Metrics for Wafer High Order Shape Characteriz...
- Publication number 20140114597
- Publication date Apr 24, 2014
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
System and Method to Emulate Finite Element Model Based Prediction...
- Publication number 20140107998
- Publication date Apr 17, 2014
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND DEVICE FOR USING SUBSTRATE GEOMETRY TO DETERMINE OPTIMUM...
- Publication number 20130310966
- Publication date Nov 21, 2013
- KLA-Tencor Technologies Corporation
- Craig W. MacNaughton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR WAFER SURFACE FEATURE DETECTION, CLASSIFICA...
- Publication number 20130304399
- Publication date Nov 14, 2013
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
Systems and Methods of Advanced Site-Based Nanotopography for Wafer...
- Publication number 20130236085
- Publication date Sep 12, 2013
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OVERLAY AND SEMICONDUCTOR PROCESS CONTROL USING A WAFER GEOMETRY ME...
- Publication number 20130089935
- Publication date Apr 11, 2013
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SU...
- Publication number 20120179419
- Publication date Jul 12, 2012
- KLA-Tencor Corporation
- Haiguang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION I...
- Publication number 20120177282
- Publication date Jul 12, 2012
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR WAFER EDGE FEATURE DETECTION AND QUANTIFICA...
- Publication number 20110218762
- Publication date Sep 8, 2011
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
SITE BASED QUANTIFICATION OF SUBSTRATE TOPOGRAPHY AND ITS RELATION...
- Publication number 20110172982
- Publication date Jul 14, 2011
- KLA-Tencor Technologies Corp.
- Sathish Veeraraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Localized Substrate Geometry Characterization
- Publication number 20110144943
- Publication date Jun 16, 2011
- KLA-Tencor Corporation
- Sathish Veeraraghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Curvature-Based Edge Bump Quantification
- Publication number 20110112796
- Publication date May 12, 2011
- KLA-Tencor Corporation
- Rabi Fettig
- G01 - MEASURING TESTING
Information Patent Application
Wafer edge detection and capacitive probe therefor
- Publication number 20080290881
- Publication date Nov 27, 2008
- Roy Mallory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Curvature-based edge bump quantification
- Publication number 20080262751
- Publication date Oct 23, 2008
- Rabi Fettig
- G01 - MEASURING TESTING

Jaydeep K. Sinha

Person

Patents Grantslast 30 patents

Process-induced distortion prediction and feedforward and feedback...

Prediction based chucking and lithography control optimization

Patterned wafer geometry measurements for semiconductor process con...

Process-induced distortion prediction and feedforward and feedback...

Systems, methods and metrics for wafer high order shape characteriz...

Systems and methods for wafer structure uniformity monitoring using...

Systems and methods for wafer surface feature detection, classifica...

Overlay and semiconductor process control using a wafer geometry me...

Prediction based chucking and lithography control optimization

System and method to emulate finite element model based prediction...

Systems and methods for effective pattern wafer surface measurement...

Process-induced asymmetry detection, quantification, and control us...

Predictive wafer modeling based focus error prediction using correl...

Systems and methods for wafer surface feature detection and quantif...

Detection of selected defects in relatively noisy inspection data

Hybrid phase unwrapping systems and methods for patterned wafer mea...

Method and device for using substrate geometry to determine optimum...

Predicting and controlling critical dimension issues and pattern de...

Systems, methods and metrics for wafer high order shape characteriz...

Using wafer geometry to improve scanner correction effectiveness fo...

System and method to emulate finite element model based prediction...

Enhanced patterned wafer geometry measurements based design improve...

Detection of selected defects in relatively noisy inspection data

Systems and methods of advanced site-based nanotopography for wafer...

Statistical overlay error prediction for feed forward and feedback...

Bright-field differential interference contrast system with scannin...

Using wafer geometry to improve scanner correction effectiveness fo...

Methods and systems of object based metrology for advanced wafer su...

Site based quantification of substrate topography and its relation...

Methods and systems for improved localized feature quantification i...

Patents Applicationslast 30 patents

Process-Induced Distortion Prediction and Feedforward and Feedback...

SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZ...

Prediction Based Chucking and Lithography Control Optimization

Overlay and Semiconductor Process Control Using a Wafer Geometry Me...

Process-Induced Asymmetry Detection, Quantification, and Control Us...

Hybrid Phase Unwrapping Systems and Methods for Patterned Wafer Mea...

System and Method to Emulate Finite Element Model Based Prediction...

Prediction Based Chucking and Lithography Control Optimization

Predicting and Controlling Critical Dimension Issues and Pattern De...

Enhanced Patterned Wafer Geometry Measurements Based Design Improve...

Predictive Modeling Based Focus Error Prediction

Patterned Wafer Geometry Measurements for Semiconductor Process Con...

Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...

Process-Induced Distortion Prediction and Feedforward and Feedback...

Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...

Enhanced Inspection and Metrology Techniques And Systems Using Brig...

Systems, Methods and Metrics for Wafer High Order Shape Characteriz...

System and Method to Emulate Finite Element Model Based Prediction...

METHOD AND DEVICE FOR USING SUBSTRATE GEOMETRY TO DETERMINE OPTIMUM...

SYSTEMS AND METHODS FOR WAFER SURFACE FEATURE DETECTION, CLASSIFICA...

Systems and Methods of Advanced Site-Based Nanotopography for Wafer...

OVERLAY AND SEMICONDUCTOR PROCESS CONTROL USING A WAFER GEOMETRY ME...

METHODS AND SYSTEMS OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SU...

METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION I...

SYSTEMS AND METHODS FOR WAFER EDGE FEATURE DETECTION AND QUANTIFICA...

SITE BASED QUANTIFICATION OF SUBSTRATE TOPOGRAPHY AND ITS RELATION...

Localized Substrate Geometry Characterization

Curvature-Based Edge Bump Quantification

Wafer edge detection and capacitive probe therefor

Curvature-based edge bump quantification