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Jaydutt Jagdish Joshi
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Irvine, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Flip-chip amplifier with termination circuit
Patent number
10,141,901
Issue date
Nov 27, 2018
Skyworks Solutions, Inc.
Guohao Zhang
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Methods for improving thermal performance of flip chip packages
Patent number
9,691,683
Issue date
Jun 27, 2017
Skyworks Solutions, Inc.
Jaydutt Jagdish Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip linear power amplifier with high power added efficiency
Patent number
9,467,940
Issue date
Oct 11, 2016
Skyworks Solutions, Inc.
Guohao Zhang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Electronic devices with improved thermal performance
Patent number
9,401,316
Issue date
Jul 26, 2016
Skyworks Solutions, Inc.
Jaydutt Jagdish Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip packages with improved thermal performance
Patent number
9,006,889
Issue date
Apr 14, 2015
Skyworks Solutions, Inc.
Jaydutt J. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
Publication number
20180198436
Publication date
Jul 12, 2018
SKYWORKS SOLUTIONS, INC.
Jaydutt Jagdish Joshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP-CHIP AMPLIFIER WITH TERMINATION CIRCUIT
Publication number
20160380603
Publication date
Dec 29, 2016
SKYWORKS SOLUTIONS, INC.
Guohao Zhang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
ELECTRONIC DEVICES WITH IMPROVED THERMAL PERFORMANCE
Publication number
20150243579
Publication date
Aug 27, 2015
SKYWORKS SOLUTIONS, INC.
Jaydutt Jagdish Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR IMPROVING THERMAL PERFORMANCE OF FLIP CHIP PACKAGES
Publication number
20150243580
Publication date
Aug 27, 2015
SKYWORKS SOLUTIONS, INC.
Jaydutt Jagdish Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP LINEAR POWER AMPLIFIER WITH HIGH POWER ADDED EFFICIENCY
Publication number
20130130752
Publication date
May 23, 2013
SKYWORKS SOLUTIONS, INC.
Guohao Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGES WITH IMPROVED THERMAL PERFORMANCE
Publication number
20130119535
Publication date
May 16, 2013
SKYWORKS SOLUTIONS, INC.
JAYDUTT J. JOSHI
H01 - BASIC ELECTRIC ELEMENTS