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Seongnam-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,923,343
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Jaekyung Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including part of underfill on portion of a m...
Patent number
11,791,282
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Jaekyung Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,538,792
Issue date
Dec 27, 2022
Samsung Electronics Co., Ltd.
Jaekyung Yoo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240162194
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Jaekyung YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240079299
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Jaekyung YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
Publication number
20230146621
Publication date
May 11, 2023
Samsung Electronics Co., Ltd.
Jaekyung YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230088032
Publication date
Mar 23, 2023
Samsung Electronics Co., Ltd.
Jaekyung YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD FOR MANUFACTUR...
Publication number
20220013474
Publication date
Jan 13, 2022
Samsung Electronics Co., Ltd.
Jaekyung YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20210366876
Publication date
Nov 25, 2021
Samsung Electronics Co., Ltd.
Jaekyung YOO
H01 - BASIC ELECTRIC ELEMENTS