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Je Bong Kang
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Asan, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Leadframe and semiconductor chip package having cutout portions and...
Patent number
6,407,446
Issue date
Jun 18, 2002
Samsung Electronics Co., Ltd.
Je Bong Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit device having dummy bonding wires
Patent number
6,031,281
Issue date
Feb 29, 2000
Samsung Electronics Co., Ltd.
Je Bong Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring between semiconductor integrated circuit chip electrode pads...
Patent number
5,923,092
Issue date
Jul 13, 1999
Samsung Electronics, Co., Ltd.
Je Bong Kang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Leadframe and semiconductor chip package having cutout portions and...
Publication number
20010006250
Publication date
Jul 5, 2001
Je Bong Kang
H01 - BASIC ELECTRIC ELEMENTS