Jea Won KIM

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Changwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 11,876,012
- Issue date Jan 16, 2024
- HAESUNG DS CO., LTD.
- Sung Il Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor package formed by roll-to-roll process
- Patent number 11,139,220
- Issue date Oct 5, 2021
- HAESUNG DS CO., LTD.
- Jea Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 10,811,302
- Issue date Oct 20, 2020
- HAESUNG DS CO., LTD.
- Sung II Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210057301
- Publication date Feb 25, 2021
- HAESUNG DS CO., LTD
- Jea Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
- Publication number 20200411362
- Publication date Dec 31, 2020
- HAESUNG DS CO., LTD
- Sung Il KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
- Publication number 20190067082
- Publication date Feb 28, 2019
- HAESUNG DS CO., LTD
- Sung Il KANG
- H01 - BASIC ELECTRIC ELEMENTS