Jean Marc Waechter

Person

Saint Vincent de Mercuze, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for splitting substrates
- Patent number 7,648,888
- Issue date Jan 19, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for reducing the trap density in a semiconductor wafer
- Patent number 7,601,606
- Issue date Oct 13, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Francois Brunier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annealing process and device of semiconductor wafer
- Patent number 7,466,907
- Issue date Dec 16, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for heat treating a semiconductor wafer
- Patent number 7,098,148
- Issue date Aug 29, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annealing process and device of semiconductor wafer
- Patent number 7,094,668
- Issue date Aug 22, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for splitting substrates
- Patent number 7,017,570
- Issue date Mar 28, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Multideposition SACVD reactor
- Patent number 6,770,144
- Issue date Aug 3, 2004
- International Business Machines Corporation
- Patrick Raffin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method for reducing the trap density in a semiconductor wafer
- Publication number 20070020886
- Publication date Jan 25, 2007
- Francois Brunier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Annealing process and device of semiconductor wafer
- Publication number 20060204230
- Publication date Sep 14, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A., a French company
- Walter Schwarzenbach
- C30 - CRYSTAL GROWTH
Information Patent Application
Apparatus and method for splitting substrates
- Publication number 20060138189
- Publication date Jun 29, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A., a French company
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Multideposition SACVD reactor
- Publication number 20050229853
- Publication date Oct 20, 2005
- Patrick Raffin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for heat treating a semiconductor wafer
- Publication number 20040259388
- Publication date Dec 23, 2004
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for splitting substrates
- Publication number 20040188487
- Publication date Sep 30, 2004
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Annealing process and device of semiconductor wafer
- Publication number 20040137762
- Publication date Jul 15, 2004
- Walter Schwarzenbach
- C30 - CRYSTAL GROWTH
Information Patent Application
Multideposition SACVD reactor
- Publication number 20020173164
- Publication date Nov 21, 2002
- International Business Machines Corporation
- Patrick Raffin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Jean Marc Waechter

Person

Patents Grantslast 30 patents

Apparatus and method for splitting substrates

Method for reducing the trap density in a semiconductor wafer

Annealing process and device of semiconductor wafer

Method for heat treating a semiconductor wafer

Annealing process and device of semiconductor wafer

Apparatus and method for splitting substrates

Multideposition SACVD reactor

Patents Applicationslast 30 patents

Method for reducing the trap density in a semiconductor wafer

Annealing process and device of semiconductor wafer

Apparatus and method for splitting substrates

Multideposition SACVD reactor

Method for heat treating a semiconductor wafer

Apparatus and method for splitting substrates

Annealing process and device of semiconductor wafer

Multideposition SACVD reactor