Jean-Paul Henry

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Sutton, CA

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for transferring solder bumps
- Patent number 7,070,087
- Issue date Jul 4, 2006
- International Business Machines Corporation
- Guy Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS
- Publication number 20040214420
- Publication date Oct 28, 2004
- International Business Machines Corporation
- Guy Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR