Jeanne M. McNamara

Follow

Person

St. Cloud, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices including bond pad having protective sidewall seal
- Patent number 8,963,266
- Issue date Feb 24, 2015
- Intersil Americas LLC
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting bond pad for subsequent processing
- Patent number 8,536,044
- Issue date Sep 17, 2013
- Intersil Americas Inc.
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICES INCLUDING BOND PAD HAVING PROTECTIVE SIDEWALL SEAL
- Publication number 20120241893
- Publication date Sep 27, 2012
- Intersil Americas Inc.
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTING BOND PAD FOR SUBSEQUENT PROCESSING
- Publication number 20120007199
- Publication date Jan 12, 2012
- Intersil Americas Inc.
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS