Jee-Yeon KIM

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly of a memory die and a logic die including laterally...
- Patent number 11,758,730
- Issue date Sep 12, 2023
- SanDisk Technologies LLC
- Fumiaki Toyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded assembly of semiconductor dies containing pad level across-d...
- Patent number 11,342,244
- Issue date May 24, 2022
- SanDisk Technologies LLC
- Jee-Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly with vertical power and control signal connection a...
- Patent number 11,211,370
- Issue date Dec 28, 2021
- SanDisk Technologies LLC
- Jee-Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing horizontal and vertical...
- Patent number 11,139,237
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device including contact-level bit-line-co...
- Patent number 11,011,209
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Jee-Yeon Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device including signal and power connecti...
- Patent number 10,872,899
- Issue date Dec 22, 2020
- SanDisk Technologies LLC
- Jee-Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including signal and power connecti...
- Patent number 10,861,873
- Issue date Dec 8, 2020
- SanDisk Technologies LLC
- Jee-Yeon Kim
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
BONDED ASSEMBLY OF A MEMORY DIE AND A LOGIC DIE INCLUDING LATERALLY...
- Publication number 20220359555
- Publication date Nov 10, 2022
- SANDISK TECHNOLOGIES LLC
- Fumiaki TOYAMA
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED ASSEMBLY WITH VERTICAL POWER AND CONTROL SIGNAL CONNECTION A...
- Publication number 20210233900
- Publication date Jul 29, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY OF SEMICONDUCTOR DIES CONTAINING PAD LEVEL ACROSS-D...
- Publication number 20210225736
- Publication date Jul 22, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT-LEVEL BIT-LINE-CO...
- Publication number 20210098029
- Publication date Apr 1, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...
- Publication number 20210057336
- Publication date Feb 25, 2021
- SANDISK TECHNOLOGIES LLC
- Shiqian SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...
- Publication number 20200357814
- Publication date Nov 12, 2020
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...
- Publication number 20200357811
- Publication date Nov 12, 2020
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS

Jee-Yeon KIM

Person

Patents Grantslast 30 patents

Bonded assembly of a memory die and a logic die including laterally...

Bonded assembly of semiconductor dies containing pad level across-d...

Bonded assembly with vertical power and control signal connection a...

Three-dimensional memory device containing horizontal and vertical...

Three-dimensional memory device including contact-level bit-line-co...

Three-dimensional memory device including signal and power connecti...

Three-dimensional memory device including signal and power connecti...

Patents Applicationslast 30 patents

BONDED ASSEMBLY OF A MEMORY DIE AND A LOGIC DIE INCLUDING LATERALLY...

BONDED ASSEMBLY WITH VERTICAL POWER AND CONTROL SIGNAL CONNECTION A...

BONDED ASSEMBLY OF SEMICONDUCTOR DIES CONTAINING PAD LEVEL ACROSS-D...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT-LEVEL BIT-LINE-CO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...