Jeesoo Mok

Person

Chongqing, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin component carrier having high stiffness and method of ma...
- Patent number 12,205,877
- Issue date Jan 21, 2025
- AT&S(Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding methods for fine-pitch components and corresponding compo...
- Patent number 12,136,580
- Issue date Nov 5, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,810,844
- Issue date Nov 7, 2023
- AT&S(Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin component carrier having high stiffness and method of ma...
- Patent number 11,424,179
- Issue date Aug 23, 2022
- AT&S(Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,289,452
- Issue date Mar 29, 2022
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising a photo-imageable dielectric and metho...
- Patent number 11,058,009
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier with Rough Surface and Smooth Surface Metal Trace...
- Publication number 20250081330
- Publication date Mar 6, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Patrick LENHARDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Methods for Fine-Pitch Components and Corresponding Compo...
- Publication number 20250063668
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20240021440
- Publication date Jan 18, 2024
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor-based Component and Method of Man...
- Publication number 20230245971
- Publication date Aug 3, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded IC Substrate Inlay, and Manufacturi...
- Publication number 20230245990
- Publication date Aug 3, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Connected Component Having Redistribution La...
- Publication number 20230232535
- Publication date Jul 20, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultra-Thin Component Carrier Having High Stiffness and Method of Ma...
- Publication number 20220399261
- Publication date Dec 15, 2022
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Methods for Fine-Pitch Components and Corresponding Compo...
- Publication number 20220319943
- Publication date Oct 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210287977
- Publication date Sep 16, 2021
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Having a Double Dielectric Layer and Method of Ma...
- Publication number 20210195735
- Publication date Jun 24, 2021
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultra-Thin Component Carrier Having High Stiffness and Method of Ma...
- Publication number 20200273785
- Publication date Aug 27, 2020
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Component Carrier Using a Separation Comp...
- Publication number 20200163223
- Publication date May 21, 2020
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20200161279
- Publication date May 21, 2020
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Comprising a Photo-Imageable Dielectric and Metho...
- Publication number 20200163218
- Publication date May 21, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Person

Patents Grantslast 30 patents

Ultra-thin component carrier having high stiffness and method of ma...

Component carrier having a double dielectric layer and method of ma...

Embedding methods for fine-pitch components and corresponding compo...

Component carrier and method of manufacturing the same

Ultra-thin component carrier having high stiffness and method of ma...

Component carrier and method of manufacturing the same

Component carrier comprising a photo-imageable dielectric and metho...

Patents Applicationslast 30 patents

Component Carrier with Rough Surface and Smooth Surface Metal Trace...

Embedding Methods for Fine-Pitch Components and Corresponding Compo...

Component Carrier and Method of Manufacturing the Same

Module Comprising a Semiconductor-based Component and Method of Man...

Component Carrier With Embedded IC Substrate Inlay, and Manufacturi...

Component Carrier With Connected Component Having Redistribution La...

Ultra-Thin Component Carrier Having High Stiffness and Method of Ma...

Embedding Methods for Fine-Pitch Components and Corresponding Compo...

Component Carrier and Method of Manufacturing the Same

Component Carrier Having a Double Dielectric Layer and Method of Ma...

Ultra-Thin Component Carrier Having High Stiffness and Method of Ma...

Method of Manufacturing a Component Carrier Using a Separation Comp...

Component Carrier and Method of Manufacturing the Same

Component Carrier Comprising a Photo-Imageable Dielectric and Metho...