Jeff HUANG

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 12,319,562
- Issue date Jun 3, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device without standoff in MEMS
- Patent number 10,773,951
- Issue date Sep 15, 2020
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 10,384,930
- Issue date Aug 20, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Two different conductive bump stops on CMOS-MEMS bonded structure
- Patent number 10,081,539
- Issue date Sep 25, 2018
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20220348455
- Publication date Nov 3, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE WITHOUT STANDOFF IN MEMS
- Publication number 20190382258
- Publication date Dec 19, 2019
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20190330052
- Publication date Oct 31, 2019
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20180312396
- Publication date Nov 1, 2018
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TWO DIFFERENT CONDUCTIVE BUMP STOPS ON CMOS-MEMS BONDED STRUCTURE
- Publication number 20180016135
- Publication date Jan 18, 2018
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY