Jeffery B. Maxson

Person

New Windsor, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for controlling wafer curvature
- Patent number 8,918,988
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods and structures for controlling wafer curvature
- Patent number 8,299,615
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure and method of creating entirely self-aligned metallic con...
- Patent number 8,298,934
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Jeffery B. Maxson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local metallization and use thereof in semiconductor devices
- Patent number 8,106,515
- Issue date Jan 31, 2012
- International Business Machines Corporation
- Jeffery B. Maxson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of creating entirely self-aligned metallic con...
- Patent number 7,964,923
- Issue date Jun 21, 2011
- International Business Machines Corporation
- Jeffery B. Maxson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local metallization and use thereof in semiconductor devices
- Patent number 7,807,570
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Jeffery B. Maxson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer cap structure including HDP/bHDP films for conductive metal...
- Patent number 7,179,760
- Issue date Feb 20, 2007
- International Buisness Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE
- Publication number 20120329265
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF CREATING ENTIRELY SELF-ALIGNED METALLIC CON...
- Publication number 20110237067
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Jeffery B. Maxson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE
- Publication number 20110049723
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL METALLIZATION AND USE THEREOF IN SEMICONDUCTOR DEVICES
- Publication number 20100314689
- Publication date Dec 16, 2010
- International Business Machines Corporation
- JEFFERY B. MAXSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF CREATING ENTIRELY SELF-ALIGNED METALLIC CON...
- Publication number 20090174006
- Publication date Jul 9, 2009
- International Business Machines Corporation
- Jeffery B. Maxson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE PLASMA CHARGE DAMAGE FROM HIGH DENSITY PLASMA CHEM...
- Publication number 20080146039
- Publication date Jun 19, 2008
- Daewon Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...
- Publication number 20060270245
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Jeffery B. Maxson

Person

Patents Grantslast 30 patents

Methods for controlling wafer curvature

Methods and structures for controlling wafer curvature

Structure and method of creating entirely self-aligned metallic con...

Local metallization and use thereof in semiconductor devices

Structure and method of creating entirely self-aligned metallic con...

Local metallization and use thereof in semiconductor devices

Bilayer cap structure including HDP/bHDP films for conductive metal...

Patents Applicationslast 30 patents

METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE

STRUCTURE AND METHOD OF CREATING ENTIRELY SELF-ALIGNED METALLIC CON...

METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE

LOCAL METALLIZATION AND USE THEREOF IN SEMICONDUCTOR DEVICES

STRUCTURE AND METHOD OF CREATING ENTIRELY SELF-ALIGNED METALLIC CON...

METHOD TO REDUCE PLASMA CHARGE DAMAGE FROM HIGH DENSITY PLASMA CHEM...

BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...