Jeffery D. Bielefeld

Person

Forest Grove, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric helmet-based approaches for back end of line (BEOL) inte...
- Patent number 11,990,403
- Issue date May 21, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization barrier structures for bonded integrated circuit inte...
- Patent number 11,532,558
- Issue date Dec 20, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contacts for semiconductor devices
- Patent number 11,437,283
- Issue date Sep 6, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned local interconnects
- Patent number 11,424,160
- Issue date Aug 23, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Activation of protected cross-linking catalysts during formation of...
- Patent number 11,406,972
- Issue date Aug 9, 2022
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch quartered three-dimensional air gaps
- Patent number 11,152,254
- Issue date Oct 19, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardened plug for improved shorting margin
- Patent number 11,024,538
- Issue date Jun 1, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric helmet-based approaches for back end of line (BEOL) inte...
- Patent number 11,011,463
- Issue date May 18, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bridge random access memory (CBRAM) devices with low the...
- Patent number 10,868,246
- Issue date Dec 15, 2020
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable metallization cell with alloy layer
- Patent number 10,665,781
- Issue date May 26, 2020
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pore-filled dielectric materials for semiconductor structure fabric...
- Patent number 10,529,660
- Issue date Jan 7, 2020
- Intel Corporation
- Jessica M. Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra thin helmet dielectric layer for maskless air gap and replace...
- Patent number 10,483,160
- Issue date Nov 19, 2019
- Intel Corporation
- Jeffery D. Bielefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically altered carbosilanes for pore sealing applications
- Patent number 9,269,652
- Issue date Feb 23, 2016
- Intel Corporation
- David J. Michalak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming, self-aligned barriers for back-end interconnects and...
- Patent number 8,461,683
- Issue date Jun 11, 2013
- Intel Corporation
- Hui Jae Yoo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dielectric spacers for metal interconnects and method to form the same
- Patent number 7,772,702
- Issue date Aug 10, 2010
- Intel Corporation
- Jeffery D. Bielefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon doped oxide deposition
- Patent number 6,677,253
- Issue date Jan 13, 2004
- Intel Corporation
- Ebrahim Andideh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS
- Publication number 20240332166
- Publication date Oct 3, 2024
- Intel Corporation
- Seda CEKLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMP...
- Publication number 20240063071
- Publication date Feb 22, 2024
- Intel Corporation
- Jeffery Bielefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS
- Publication number 20230197836
- Publication date Jun 22, 2023
- Intel Corporation
- Carl Hugo Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
- Publication number 20230187395
- Publication date Jun 15, 2023
- Intel Corporation
- Nafees A. KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP
- Publication number 20220415818
- Publication date Dec 29, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...
- Publication number 20210225698
- Publication date Jul 22, 2021
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...
- Publication number 20210098387
- Publication date Apr 1, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20210098360
- Publication date Apr 1, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20200294998
- Publication date Sep 17, 2020
- Intel Corporation
- AARON D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LOCAL INTERCONNECTS
- Publication number 20200258778
- Publication date Aug 13, 2020
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDENED PLUG FOR IMPROVED SHORTING MARGIN
- Publication number 20200098629
- Publication date Mar 26, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH QUARTERED THREE-DIMENSIONAL AIR GAPS
- Publication number 20190385897
- Publication date Dec 19, 2019
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PORE-FILLED DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FABRIC...
- Publication number 20190252313
- Publication date Aug 15, 2019
- Intel Corporation
- Jessica M. TORRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BRIDGE RANDOM ACCESS MEMORY (CBRAM) DEVICES WITH LOW THE...
- Publication number 20190229264
- Publication date Jul 25, 2019
- Intel Corporation
- Elijah V. KARPOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...
- Publication number 20190139887
- Publication date May 9, 2019
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE METALLIZATION CELL WITH ALLOY LAYER
- Publication number 20190058115
- Publication date Feb 21, 2019
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVATION OF PROTECTED CROSS-LINKING CATALYSTS DURING FORMATION OF...
- Publication number 20180236440
- Publication date Aug 23, 2018
- Intel Corporation
- James M. BLACKWELL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ULTRA THIN HELMET DIELECTRIC LAYER FOR MASKLESS AIR GAP AND REPLACE...
- Publication number 20180226289
- Publication date Aug 9, 2018
- Intel Corporation
- Jeffery D. BIELEFELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20160307796
- Publication date Oct 20, 2016
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY ALTERED CARBOSILANES FOR PORE SEALING APPLICATIONS
- Publication number 20130320520
- Publication date Dec 5, 2013
- David J. Michalak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20120248608
- Publication date Oct 4, 2012
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP INTERCONNECT SYSTEM
- Publication number 20090001594
- Publication date Jan 1, 2009
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric spacers for metal interconnects and method to form the same
- Publication number 20080073748
- Publication date Mar 27, 2008
- Jeffery D. Bielefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glycol doping agents in carbon doped oxide films
- Publication number 20060105581
- Publication date May 18, 2006
- Jeffery D. Bielefeld
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Carbon doped oxide deposition
- Publication number 20040043555
- Publication date Mar 4, 2004
- Ebrahim Andideh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Jeffery D. Bielefeld

Person

Patents Grantslast 30 patents

Subtractively patterned interconnect structures for integrated circ...

Dielectric helmet-based approaches for back end of line (BEOL) inte...

Interconnect structures and methods of fabrication

Metallization barrier structures for bonded integrated circuit inte...

Subtractively patterned interconnect structures for integrated circ...

Backside contacts for semiconductor devices

Self-aligned local interconnects

Activation of protected cross-linking catalysts during formation of...

Interconnect structures and methods of fabrication

Pitch quartered three-dimensional air gaps

Hardened plug for improved shorting margin

Dielectric helmet-based approaches for back end of line (BEOL) inte...

Conductive bridge random access memory (CBRAM) devices with low the...

Programmable metallization cell with alloy layer

Pore-filled dielectric materials for semiconductor structure fabric...

Ultra thin helmet dielectric layer for maskless air gap and replace...

Chemically altered carbosilanes for pore sealing applications

Self-forming, self-aligned barriers for back-end interconnects and...

Dielectric spacers for metal interconnects and method to form the same

Carbon doped oxide deposition

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMP...

INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS

OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...

METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...

NTERCONNECT STRUCTURES AND METHODS OF FABRICATION

BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES

SELF-ALIGNED LOCAL INTERCONNECTS

HARDENED PLUG FOR IMPROVED SHORTING MARGIN

PITCH QUARTERED THREE-DIMENSIONAL AIR GAPS

PORE-FILLED DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FABRIC...

CONDUCTIVE BRIDGE RANDOM ACCESS MEMORY (CBRAM) DEVICES WITH LOW THE...

DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...

PROGRAMMABLE METALLIZATION CELL WITH ALLOY LAYER

ACTIVATION OF PROTECTED CROSS-LINKING CATALYSTS DURING FORMATION OF...

ULTRA THIN HELMET DIELECTRIC LAYER FOR MASKLESS AIR GAP AND REPLACE...

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

CHEMICALLY ALTERED CARBOSILANES FOR PORE SEALING APPLICATIONS

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

AIRGAP INTERCONNECT SYSTEM

Dielectric spacers for metal interconnects and method to form the same

Glycol doping agents in carbon doped oxide films

Carbon doped oxide deposition